Browse "School of Electrical Engineering(전기및전자공학부)" by Type Article
Showing results 12061 to 12120 of 14259
Thienothiophenyl-Isoquinoline Iridium Complex-Based Deep Red to Near-Infrared Organic Light-Emitting Diodes with Low Driving Voltage and High Radiant Emittance for Practical Biomedical Applications Park, Yongjin; Lee, Gyeong Seok; Choi, Hye-Ryung; Jeon, Yongmin; Jeong, So Yeong; Noh, Byeongju; Park, Kyoung-Chan; et al, Advanced Photonics Research, v.2, no.10, pp.2100121, 2021-10 |
| Thin Film Bulk Acoustic Resonators for RF Applications Linh Mai; Jae-Young Lee; 윤기완, 국제해양정보통신학회영문논문지, v.4, no.3, pp.111 - 113, 2006-09 |
| Thin film encapsulation for organic light emitting diodes using a multi-barrier composed of MgO prepared by atomic layer deposition and hybrid materials Kim, Eungtaek; Han, Yuncheol; Kim, Woohyun; Choi, Kyung Cheol; Im, Hyeon-Gyun; Bae, Byeong-Soo, ORGANIC ELECTRONICS, v.14, no.7, pp.1737 - 1743, 2013-07 |
| Thin film solar cells on honeycomb-structured substrates for photovoltaic building blocks Baik, Seung Jae; Lee, Yong-Min; Lim, Koeng Su; Kim, Keun-Taek, RENEWABLE ENERGY, v.64, pp.98 - 104, 2014-04 |
| Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems Cho, Yeonje; Lee, Seongsoo; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Park, Junyong; et al, IEEE Transactions on Electromagnetic Compatibility, v.60, no.4, pp.1001 - 1009, 2018-08 |
| Thin Ion-Gel Dielectric Layer to Enhance the Stability of Polymer Transistors Lee, Sung Won; Shin, Minkwan; Park, Jae Yoon; Kim, Bong Soo; Tu, Deyu; Jeon, Sanghun; Jeong, Unyong, SCIENCE OF ADVANCED MATERIALS, v.7, no.5, pp.874 - 880, 2015-05 |
| Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices Jung H.H.; Song J.; Nie S.; Jung H.N.; Kim M.S.; Jeong, Jae-Woong; Song Y.M.; et al, Advanced Materials Technologies, v.3, no.11, 2018-11 |
| Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02 |
| Thin-Film Thermoelectric Module for Power Generator Applications Using a Screen-Printing Method Lee, Heon-Bok; Yang, Hyun Jeong; We, Ju Hyung; Kim, Kukjoo; Choi, Kyung Cheol; Cho, Byung Jin, JOURNAL OF ELECTRONIC MATERIALS, v.40, no.5, pp.615 - 619, 2011-05 |
| Thin-film transistor-driven vertically stacked full-color organic light-emitting diodes for high-resolution active-matrix displays Choi, Sukyung; Kang, Chan-mo; Byun, Chun-Won; Cho, Hyunsu; Kwon, Byoung-Hwa; Han, Jun-Han; Yang, Jong-Heon; et al, NATURE COMMUNICATIONS, v.11, no.1, 2020-06 |
| Three Phase Resonant Pole Inverter Using a New Sepa Sated Soft Switching Resonant Pole J.G.Cho; D.Y.Hu; G.H.Cho, 전기학회논문지, v.4, no.2, pp.90 - 97, 1991 |
| Three phase three-level PWM switched voltage source inverter with zero neutral point potential Oh, Won-Sik; Han, Sang-Kyoo; Choi, Seong-Wook; Moon, GunWoo, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.21, no.5, pp.1320 - 1326, 2006-09 |
| Three-Dimensional Blood Vessel Quantification via Centerline Deformation Kang, Dong-Goo; Suh, Dae Chul; Ra, Jong Beom, IEEE TRANSACTIONS ON MEDICAL IMAGING, v.28, pp.405 - 414, 2009-03 |
| Three-dimensional electro-floating display system using an integral imaging method Min, SW; Hahn, Minsoo; Kim, J; Lee, B, OPTICS EXPRESS, v.13, pp.4358 - 4369, 2005-06 |
| Three-Dimensional Fin-Structured Semiconducting Carbon Nanotube Network Transistor Lee, Dong-Il; Lee, Byung-Hyun; Yoon, Jinsu; Ahn, Dae-Chul; Park, Jun-Young; Hur, Jae; Kim, Myung-Su; et al, ACS NANO, v.10, no.12, pp.10894 - 10900, 2016-12 |
| Three-dimensional fluorescence microscopy through virtual refocusing using a recursive light propagation network Shin, Changyeop; Ryu, Hyun; Cho, Eun-Seo; Han, Seungjae; Lee, Kang-Han; Kim, Cheol-Hee; Yoon, Young-Gyu, MEDICAL IMAGE ANALYSIS, v.82, 2022-11 |
| Three-Dimensional Integration Approach to High-Density Memory Devices Kim, Hojung; Jeon, Sanghun; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11 |
| Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate Yeo, S. K.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06 |
| Three-dimensional nanopillar-array photovoltaics on low-cost and flexible substrates Fan, Zhiyong; Razavi, Haleh; Do, Jae-won; Moriwaki, Aimee; Ergen, Onur; Chueh, Yu-Lun; Leu, Paul W.; et al, NATURE MATERIALS, v.8, no.8, pp.648 - 653, 2009-08 |
| Three-dimensional quantum simulation of multigate nanowire field effect transistors Shin, Mincheol, MATHEMATICS AND COMPUTERS IN SIMULATION, v.79, no.4, pp.1060 - 1070, 2008-12 |
| Three-dimensional solar steam generation device with additional non-photothermal evaporation Kim, Kwanghyun; Yu, Sunyoung; Kang, Se-Young; Ryu, Seung-Tak; Jang, Ji-Hyun, DESALINATION, v.469, 2019-11 |
| Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids Park, Yoonseok; Franz, Colin K.; Ryu, Hanjun; Luan, Haiwen; Cotton, Kristen Y.; Kim, Jong Uk; Chung, Ted S.; et al, SCIENCE ADVANCES, v.7, no.12, 2021-03 |
| Three-dimensionally patterned Ag-Pt alloy catalyst on planar Si photocathodes for photoelectrochemical H-2 evolution Lim, Sung Yul; Ha, Kyungyeon; Ha, Heonhak; Lee, Soo Youn; Jang, Min Seok; Choi, Mansoo; Chung, Taek Dong, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.21, no.8, pp.4184 - 4192, 2019-01 |
| Three-Electrode Metal-Oxide Gas Sensor System With CMOS Interface IC Park, Jeong Ho; Park, Kwang Min; Kim, Tae-Wan; Shin, Seongheon; Park, Chong-Ook; Yoo, Hyung-Joun, IEEE SENSORS JOURNAL, v.17, no.3, pp.784 - 793, 2017-02 |
| Three-Level Capacitor Clamping Single Sustaining Driver With Dual Energy Recovery Path for Low Cost AC Plasma Display Panel Choi, SW; Moon, GunWoo, JOURNAL OF DISPLAY TECHNOLOGY, v.5, pp.398 - 407, 2009-10 |
| Three-level differential buffer for increasing noise margin in pseudo-differential signalling Ha, K. -S.; Kim, Lee-Sup; Bae, S. -J.; Park, K. -I.; Choi, J. S.; Jun, Y. -H., ELECTRONICS LETTERS, v.46, no.21, pp.1429 - 1430, 2010-10 |
| Three-Level Resonant Converter With Double Resonant Tanks for High-Input-Voltage Applications Lee, Il-Oun; Cho, Shin-young; Moon, Gun-Woo, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.59, no.9, pp.3450 - 3463, 2012-09 |
| Three-stage clos-network switch architecture with buffered center stage for multi-class traffic Kang, MK; Kyung, Chong-Min, JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, v.15, pp.263 - 276, 2006-04 |
| Three-stage model for robust real-time face tracking Do, Jun-Hyeong; Bien, Zeung nam, INTERNATIONAL JOURNAL OF IMAGING SYSTEMS AND TECHNOLOGY, v.17, no.6, pp.321 - 327, 2007 |
| Three-STEP HEURISTIC ALGORITHM FOR OPTIMAL PLA COLUMN FOLDING YANG, YY; Kyung, Chong-Min, ELECTRONICS LETTERS, v.24, no.17, pp.1088 - 1090, 1988-08 |
| Three-STEP PIN ASSIGNMENT ALGORITHM FOR BUILDING BLOCK LAYOUT CHOI, SG; Kyung, Chong-Min, ELECTRONICS LETTERS, v.28, no.20, pp.1882 - 1884, 1992-09 |
| Three-Switch Active-Clamp Forward Converter With Low Switch Voltage Stress and Wide ZVS Range for High-Input-Voltage Applications Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung Joong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.25, pp.889 - 898, 2010-04 |
| Three-terminal vertical ferroelectric synaptic barristor enabled by HZO/ graphene heterostructure with rebound depolarization Jang, Seonghoon; Kim, Yongjun; Jeon, Jihoon; Ham, Seonggil; Choi, Sanghyeon; Yang, Jehyeon; Kim, Seong Keun; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.965, 2023-11 |
| Three-transistor one-time programmable (OTP) ROM cell array using standard CMOS gate oxide antifuse Kim, J; Lee, Kwyro, IEEE ELECTRON DEVICE LETTERS, v.24, pp.589 - 591, 2003-09 |
| THRESHOLD BOOLEAN FILTERS LEE, KD; Lee, Yong-Hoon, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.42, no.8, pp.2022 - 2036, 1994-08 |
| THRESHOLD SELECTION ALGORITHM FOR EXTRACTING A UNIFORM COLOR REGION IN AN IMAGE CHANG, BH; Kim, Seong-Dae; Kim, Jae Kyoon, ELECTRONICS LETTERS, v.23, no.25, pp.1362 - 1363, 1987-12 |
| Threshold Voltage Tuning Technique in Gate-All-Around MOSFETs by Utilizing Gate Electrode With Potential Distribution Park, Jun-Young; Bae, Hagyoul; Moon, Dong-Il; Jeon, Chang-Hoon; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.37, no.11, pp.1391 - 1394, 2016-11 |
| Threshold-based camera motion characterization of MPEG video Kim, JG; Chang, HS; Kim, J; Kim, Hyung-Myung, ETRI JOURNAL, v.26, pp.269 - 272, 2004-06 |
| Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Throughput Analysis Considering Coupling Effect in IEEE 802.11 Networks with Hidden Stations Kim, Tae-Joon; Lim, Jong-Tae, IEEE COMMUNICATIONS LETTERS, v.13, pp.175 - 177, 2009-03 |
| THROUGHPUT ANALYSIS FOR 2 ARQ SCHEMES USING COMBINED TRANSITION MATRIX KIM, SR; Un, Chong-Kwan, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.11, pp.1679 - 1683, 1992-11 |
| THROUGHPUT ANALYSIS OF CHANNEL LOAD SENSE MULTIPLE ACCESS WITH OVERLOAD DETECTION PROTOCOL IN SPREAD SPECTRUM PACKET RADIO NETWORKS LIM, DM; Lee, Hwang Soo, ELECTRONICS LETTERS, v.27, no.20, pp.1809 - 1810, 1991-09 |
| Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism Lee, IG; Yoo, Hyung Joun; Park, Sin Chong, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E88B, no.1, pp.402 - 407, 2005-01 |
| Throughput and Delay Performance of DSL Broadband Access with Cross-Layer Dynamic Spectrum Management Tsiaflakis, Paschalis; Yi, Yung; Chiang, Mung; Moonen, Marc, IEEE TRANSACTIONS ON COMMUNICATIONS, v.60, no.9, pp.2700 - 2711, 2012-09 |
| Throughput Characteristics by Multiuser Diversity in a Cognitive Radio System Hong, Jun-Pyo; Choi, Wan, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.59, no.8, pp.3749 - 3763, 2011-08 |
| Throughput Efficiency of LAPB/D Protocol with Multi-Reject Error Recovery Procedure W.Y.Jung; C.K.Un, ELECTRONICS LETTERS, v.25, no.19, pp.1318 - 1320, 1989-09 |
| Throughput enhancement scheme in an OFCDM system over slowly-varying frequency-selective channels Chang, K; Han, Youngnam, INFORMATION NETWORKING: CONVERGENCE IN BROADBAND AND MOBILE NETWORKING BOOK SERIES: LECTURE NOTES IN COMPUTER SCIENCE, v.3391, pp.697 - 706, 2005 |
| Throughput Estimation of Downlink Packet Access Systems Based on a Point Mass Approximation Concept Kim, Junsu; Moon, Sung Ho; Sung, Dan Keun, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.59, no.7, pp.3356 - 3363, 2010-09 |
| Throughput Improvement in Wireless Multi-Hop Ad-Hoc Networks Using Load Control Oh, Jun-Han; Lim, Jong-Tae, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E92B, pp.314 - 317, 2009-01 |
| Throughput Scaling of Covert Communication Over Wireless Adhoc Networks Cho, Kang-Hee; Lee, Si-Hyeon; Tan, Vincent Y. F., IEEE TRANSACTIONS ON INFORMATION THEORY, v.66, no.12, pp.7684 - 7701, 2020-12 |
| THROUGHPUT-DELAY AND STABILITY ANALYSIS OF AN ASYNCHRONOUS SPREAD SPECTRUM PACKET RADIO NETWORK LIM, DM; Lee, Hwang Soo, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.41, no.4, pp.469 - 478, 1992-11 |
| ThumbAir: In-Air Typing for Head Mounted Displays Gil, Hyunjae; Oakley, Ian, PROCEEDINGS OF THE ACM ON INTERACTIVE MOBILE WEARABLE AND UBIQUITOUS TECHNOLOGIES-IMWUT, v.6, no.4, 2022-12 |
| THz Detector with an Antenna Coupled Stacked CMOS Plasma-Wave FET Chai, Seung Wan; Lim, Sungmook; Hong, Song-Cheol, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.12, pp.869 - 871, 2014-12 |
| Ti thickness effects in Pt/Ti bottom electrode on properties of (Ba,Sr)TiO3 thin film Cha, SY; Lee, SH; Lee, Hee Chul, INTEGRATED FERROELECTRICS, v.16, no.1-4, pp.183 - 190, 1997 |
| TID Effect Test of the ICS307GI-03LF Serially Programmable Clock Source for Space Applications Shin, Goo-Hwan; Ryu, Kwang-Sun; Myung, Noh-Hoon; Kim, Ee-Eul, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.59, pp.670 - 673, 2011-08 |
| Tilted-Beam Switched Array Antenna for UAV Mounted Radar Applications with 360 degrees Coverage Lee, Cheol Ung; Noh, Gunhark; Ahn, ByungKuon; Yu, Jong-Won; Lee, Han Lim, ELECTRONICS, v.8, no.11, 2019-11 |
| Time Delay Based Fuzzy Logic Control (TDFLC) and Its Stabilty Analysis Myung, HC; Bien, Zeung nam, IEEE TRANSACTIONS ON FUZZY SYSTEMS, 2001 |
| Time dependent behavior of a localized electron at a heterojunction boundary of graphene Jang, Min Seok; Kim, Hyungjun; Atwater, Harry A.; Goddard, William A., III, APPLIED PHYSICS LETTERS, v.97, no.4, 2010-07 |
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