Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author 220

Showing results 1 to 60 of 87

1
9-12 Cr 강의 크리프 파단강도에 미치는 합금원소의 영향

Yu, Jin, pp.349 - 358, 1998-01-01

2
A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders

Jee, YK; Sohn, YC; Yu, Jin; Lee, TY; Seo, HN; Kim, KH; Ahn, JH; et al, 2006 International Conference on Electronic Materials and Packaging, EMAP, pp.571 - 579, 2006-12-11

3
A Fracture Mechanics Analysis of Popcorn Cracking in the Plastic IC Packages

Yu, Jin; Park, YB, IEEE/CPMT Int. Elec. Manuf. Tech. Symp., pp.12 - 19, 1997-01-01

4
A New Method Estimate Creep Rupture Life of High Temperature Alloys

유진; Chung, JO, Proc. 1st Conf. on Mechanical Behaviors, pp.75 - 80, 1987

5
A Study of Residual Stress Measurement on CVD Diamond Films

Yu, Jin, pp.141 - 146, 1998-01-01

6
A Study on the AnormalousYield Behavior of Hyper-Stoichiometric Fe3Al Intermetallic Compound

Yu, Jin, Elselvier Science Pub., pp.797 - 801, 1991-06-01

7
Adhesion strength of CuCr alloy films to polyimide

Ahn, EC; Yu, Jin; Park, IS, Spring Meeting on MRS, v.390, pp.55 - 60, 1995-04-17

8
Adhesion study of copper and chromium films to polyimide

Chung, TG; Yu, Jin; Kim, YH; Ahn, EC; Park, IS, Proceedings of the Fall 1993 MRS Meeting, v.323, pp.377 - 382, 1993-11-29

9
An Adhesion Study of Copper and Chromium Films to Polyimide

Yu, Jin, Mat. Res. Soc. Symp, pp.377 - 372, 1994-10-01

10
Bi가 첨가된 Sn-3.5Ag 솔더볼과 Cu/Ni-Co/Au 하부층과의 접합 강도 연구

유진; Shin, SW, 한국 마이크로전자 및 패키징학회, pp.98 - 103, 2002

11
Combined analysis of moisture diffusion with interface fracture mechanics on the interface delamination in the plastic IC packages during reflow soldering

Park, YB; Yu, Jin, Proceedings of the 1998 MRS Spring Symposium, v.515, pp.31 - 36, 1998-04-14

12
Comparative Study of Thermally Conductive Fillers in Underfills

Yu, Jin; Lee, WS; Lee, TY, 2004 ICEP Proceedings, pp.393 - 398, 2004

13
Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application

Yu, Jin; Sohn, YC; Jee, YK; Seo, HS; Kim, KH; Ahn, JH; Lee, YM, IMAPS 2005 Proceedings, 2005

14
Compositional Factors that Enhance or Retard Temper Embrittlement

Yu, Jin, Phil. Trans. Roy. Soc, pp.229 - 230, 1980-08-01

15
Correlation between Zn Addition and Mechanical Reliability of Sn-3.5Ag-Xzn on Electroless Ni(P) / Au Pads

Yu, Jin, ICEP2007, pp.197 - 204, 2007

16
Crack TipPlasticity inCopper Single Crystal

Yu, Jin, Multiscale Deformation and Fracture in Materials and Structures--- James R Rice 60th Anniversary Volume, pp.311 - 329, 2000-07-01

17
Creep Deformation Behaviors of Tin Pest Resistant Solder Alloys

Yu, Jin; Kim, SB; Sohn, YC, ICEP 2005, pp.196 - 201, 2005

18
Creep Deformation of Microstructurally Stable Sn-3.5Ag-xBi Solders

Yu, Jin; Shin, SW, Proc.3rd Electronic Materials and Packaging, pp.229 - 234, 2001

19
Creep(소성변형 및 가공)

유진, Proc. Plastic Deformation and Working (Bando Pub. Co.), pp.340 - 367, 1988

20
Cu-Cr/Polyimide 계의 계면 파괴 에너지에 관한 연구

Yu, Jin, 제12회 재료강도심포지엄, pp.479 - 485, 1998-01-01

21
Cu/Cr/Polyimide 계의 파괴에너지에 관한 연구

유진; Park, YB; Park, IS, 제12회 재료강도심포지엄, pp.479 - 485, 1998

22
Dislocation Pinning Effect of Grain Boundary Segregated Solute Atoms at Crack Tip

Yu, Jin, Mat. Res. Soc. Symp. Proc., pp.361 - 366, 1988-07-01

23
Effect of 85C/85% R.H. treatment on the Adhesion Strength of CuCr Alloy Films on Polyimide

Yu, Jin, Proc. of the 2nd Pacific Rim Int. Conf. Adv. Mater. and Processiong (PRICM-2), pp.0 - 0, 1995-04-01

24
Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations

Jee, YK; Xia, YH; Yu, Jin; Kang, HW; Lee, TY, 58th Electronic Components and Technology Conference, ECTC 2008, pp.491 - 494, 2008-05-27

25
Effect of alloying W in Ni(5P) metallization of solder joints

Jang, DM; Yu, Jin, 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.141 - 144, 2008-10-22

26
Effect of electrodeposition conditions on Kirkendall void formation between electrodeposited Cu film and Sn-3.5Ag solder

Kim, JY; Yu, Jin; Lee, TY, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1620 - 1625, 2007-05-29

27
Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.83 - 88, 2005-05-31

28
Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging

Jurenka, C; Kim, JY; Wolf, MJ; Engelmann, G; Ehrmann, O; Yu, Jin; Reichl, H, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.89 - 93, 2005-05-31

29
Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders

Joo, DK; Yu, Jin, 52nd Electronic Components and Technology Conference, 2002, pp.1221 - 1225, 2002-05-28

30
Effects of P and Sn on the Creep of a 1%CrMoV Steel and of Iron-Based Model Alloys

Yu, Jin; Jager, W; Grabke, HJ, Proceeding of 2nd International Conference on Creep and Fracture Engineering Materials and Structures, Pineridge Press., pp.649 - 659, 1984

31
Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps

Yu, Jin; Kim, JY; Jurenka, C; Wolf, J; Engelmann, G; Herbert Reichl, EMAP 2004 Proceedings, pp.373 - 378, 2004

32
Effects of W addition in Ni(P) UBM on the solder joint reliability

Jang, DM; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19

33
Estimation of the interfacial fracture energy of metal/polymer system in microelectronic packaging

Song, JY; Yu, Jin, 2001 MRS Spring Meeting, v.682, pp.150 - 155, 2001-04-16

34
Estimations of the Interfacial Fracture Energy of Metal Polymer System in Microelectronic Packaging

Yu, Jin; Son, JY, MRS Proc., pp.N6.2.1 -, 2001

35
Fabrication of multiwall carbon nanotube-nanocrystalline copper nanocomposite film by electrochemical deposition

Yoo, JJ; Song, JY; Yu, Jin, Nanophase and Nanocomposite Materials V, pp.179 - 183, 2007-11-26

36
Fracture mechanics analysis of the popcorn cracking in the plastic IC packages

Park, YB; Yu, Jin, Proceedings of the 1997 21st IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, pp.12 - 19, 1997-10-13

37
Fracture Mechanics Studies of the High Temperature Fracture at the KAIST

Yu, Jin, pp.171 - 189, 1986-07-01

38
Fracture Mechanics Studies of the High Temperature Fracture at the Korea Advanced Institute of Science and Technology

유진, ROK-ROC Workshop on Fracture of Metals at National Tsing Hua Univ.Taiwan, pp.171 - 189, 1986

39
Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations

Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006

40
Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations

Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19

41
Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM

Yu, Jin; Kim, JY; Sohn, YC, Micro System Technologies 2005 Proceedings, pp.337 - 344, 2005

42
Investigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages

Kim, SH; Kim, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.251 - 255, 2002-09-04

43
Low resistance and Low temperature Bonding between Silver and Indium

유진; Cho, SI; Kim, YH, 2nd Int. Meeting on Information Display, pp.275 - 278, 2002

44
Measurement of Metal/Polymer Interfacial Fracture energy in Microelectron in Packaging

Yu, Jin; Song, JY, 3rd Electronics.Packaging Technology Conference(EPTC2000), pp.246 - 250, 2000-12-01

45
Multi-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material

Yoo, JJ; Song, JY; Yu, Jin; Lyeo, HK; Lee, S; Hahn, JH, 2008 58th Electronic Components and Technology Conference, ECTC, pp.1282 - 1286, 2008-05-27

46
New Manufacturing Process for Flexible Printed Circuit Board (PCB) with Cu Conductive Lines of 5 μm pitch

Lee, HJ; Yu, Jin; Lee, TY, 2003 International Symposium on Microelectronics, v.5288, pp.363 - 367, 2003-11-18

47
NiCr강의 고온 파단 기구

유진; Hong, SH; Cho, HC, Proc. 2nd Conf. on Mechanical Behaviors, pp.121 - 125, 1988

48
Nucleation of an Elliptic Dislocation Loop from a Crack Tip

Yu, Jin, The Japan Institude of Metals, pp.399 - 402, 1994-06-01

49
Overview of the Electronic Packaging Technologies in Korea

Yu, Jin; Sohn, YC; Kim, JI, ICEP 2005, pp.4 - 8, 2005

50
Phase transformation and residual stress evolution in electroless Ni-P UBM used in low cost flip chip technology

Song, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.261 - 266, 2002-09-04

51
Relaxation of Crack Tip Stresses by Diffusive Growth of Frain Boundary Cavities

Yu, Jin; Jeon, JY, Proc. 5th Int. Conf. Strength of Materials(ICSMA-5), (The Japan Institute of Metals), pp.611 - 614, 1994-06-01

52
Sn(or SnAg)/Ni(P)와 Sn/Cu 다층박막의 열사이클 동안 발생하는 잔류응력 과 미세구조의 변화

유진; Song, JY, 한국 마이크로전자 및 패키징학회, pp.265 - 269, 2003

53
Sn-3.5Ag 솔더와 Ni/Cu UBM과의 반응 중 금속간화합물의 형성과 충격신뢰성과의 연관성에 관한 연구

유진; 김종연; 손윤철, IMAPS-Korea 2005 추계 기술심포지움, pp.3 - 6, 2005

54
Sn-3.5Ag 솔더의 전단 크리프 특성

유진; Huang, ML; 김성범, IMAPS-Korea 2005 추계 기술심포지움, pp.96 - 99, 2005

55
Sn-Ag 범프의 조성과 표면 형상에 미치는 도금 인자들에 관한 연구

유진, 한국마이크로전자 및 패키징학회, pp.106 - 109, 2003

56
Spalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.177 - 181, 2004-01-05

57
Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.75 - 81, 2004-06-01

58
T Peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가(Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test)

유진; Song, JY, IMAPS Korea 2000 , Fall Symp. Dankuk Uni pp.107 - 111, 2000

59
The effects of carbon and austenite stabilizing elements (Co, Cu, Ni and Mn) on the microstructural changes and the creep rupture strength in 9-12% Cr ferritic heat resistant steels

Ryu, SH; Kim, MS; Lee, YS; Kim, JT; Yu, Jin; Lee, BJ, 4th International Conference on Advances in Materials Technology for Fossil Power Plants, v.2005, pp.1280 - 1298, 2004-10-25

60
The Solder Joint and Runner Metal Reliability of Wafer-Level CSP

유진, 50th Electronic Components and Technology Conference, v.0, no.0, pp.87 - 92, 50th Electronic Components and Technology Conference, 2000-05

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