Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
- Issue Date
- 2005-05-31
- Language
- ENG
- Citation
55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.89 - 93
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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