DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jurenka, C | - |
dc.contributor.author | Kim, JY | - |
dc.contributor.author | Wolf, MJ | - |
dc.contributor.author | Engelmann, G | - |
dc.contributor.author | Ehrmann, O | - |
dc.contributor.author | Yu, Jin | - |
dc.contributor.author | Reichl, H | - |
dc.date.accessioned | 2013-03-17T02:03:19Z | - |
dc.date.available | 2013-03-17T02:03:19Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-05-31 | - |
dc.identifier.citation | 55th Electronic Components and Technology Conference, ECTC 2005, v.1, no., pp.89 - 93 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/138642 | - |
dc.language | ENG | - |
dc.title | Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-24644443368 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 1 | - |
dc.citation.beginningpage | 89 | - |
dc.citation.endingpage | 93 | - |
dc.citation.publicationname | 55th Electronic Components and Technology Conference, ECTC 2005 | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Jurenka, C | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Wolf, MJ | - |
dc.contributor.nonIdAuthor | Engelmann, G | - |
dc.contributor.nonIdAuthor | Ehrmann, O | - |
dc.contributor.nonIdAuthor | Reichl, H | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.