Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders
- Issue Date
- 2002-05-28
- Language
- ENG
- Citation
52nd Electronic Components and Technology Conference, 2002, pp.1221 - 1225
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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