Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Joo, DK | - |
| dc.contributor.author | Yu, Jin | - |
| dc.date.accessioned | 2013-03-16T00:04:25Z | - |
| dc.date.available | 2013-03-16T00:04:25Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-05-28 | - |
| dc.identifier.citation | 52nd Electronic Components and Technology Conference, 2002, v., no., pp.1221 - 1225 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/125364 | - |
| dc.language | ENG | - |
| dc.title | Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-0036287380 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1221 | - |
| dc.citation.endingpage | 1225 | - |
| dc.citation.publicationname | 52nd Electronic Components and Technology Conference, 2002 | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Joo, DK | - |
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