Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders
- Issue Date
- 2004-06-01
- Language
- ENG
- Citation
2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.75 - 81
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.