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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders

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dc.contributor.authorSohn, YC-
dc.contributor.authorYu, Jin-
dc.contributor.authorKang, SK-
dc.contributor.authorShih, DY-
dc.contributor.authorLee, TY-
dc.date.accessioned2013-03-18T01:11:41Z-
dc.date.available2013-03-18T01:11:41Z-
dc.date.created2012-02-06-
dc.date.issued2004-06-01-
dc.identifier.citation2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, no., pp.75 - 81-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/143454-
dc.languageENG-
dc.titleStudy of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders-
dc.typeConference-
dc.identifier.scopusid2-s2.0-10344267518-
dc.type.rimsCONF-
dc.citation.volume1-
dc.citation.beginningpage75-
dc.citation.endingpage81-
dc.citation.publicationname2004 Proceedings - 54th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorSohn, YC-
dc.contributor.nonIdAuthorKang, SK-
dc.contributor.nonIdAuthorShih, DY-
dc.contributor.nonIdAuthorLee, TY-
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MS-Conference Papers(학술회의논문)
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