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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Bi가 첨가된 Sn-3.5Ag 솔더볼과 Cu/Ni-Co/Au 하부층과의 접합 강도 연구

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유진researcher / Shin, SW
Issue Date
2002
Language
KOR
Citation

한국 마이크로전자 및 패키징학회, pp.98 - 103

URI
http://hdl.handle.net/10203/134970
Appears in Collection
MS-Conference Papers(학술회의논문)
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