Fracture mechanics analysis of the popcorn cracking in the plastic IC packages

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Issue Date
1997-10-13
Language
ENG
Citation

Proceedings of the 1997 21st IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, pp.12 - 19

URI
http://hdl.handle.net/10203/123564
Appears in Collection
MS-Conference Papers(학술회의논문)
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