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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of alloying W in Ni(5P) metallization of solder joints

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Jang, DM / Yu, Jinresearcher
Issue Date
2008-10-22
Language
ENG
Citation

10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.141 - 144

URI
http://hdl.handle.net/10203/156214
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MS-Conference Papers(학술회의논문)
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