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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Sn(or SnAg)/Ni(P)와 Sn/Cu 다층박막의 열사이클 동안 발생하는 잔류응력 과 미세구조의 변화

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유진researcher / Song, JY
Issue Date
2003
Language
KOR
Citation

한국 마이크로전자 및 패키징학회, pp.265 - 269

URI
http://hdl.handle.net/10203/148707
Appears in Collection
MS-Conference Papers(학술회의논문)
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