Combined analysis of moisture diffusion with interface fracture mechanics on the interface delamination in the plastic IC packages during reflow soldering

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Issue Date
1998-04-14
Language
ENG
Citation

Proceedings of the 1998 MRS Spring Symposium, v.515, pp.31 - 36

ISSN
0272-9172
URI
http://hdl.handle.net/10203/117416
Appears in Collection
MS-Conference Papers(학술회의논문)
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