DSpace at KOASAS: The Solder Joint and Runner Metal Reliability of Wafer-Level CSP

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

The Solder Joint and Runner Metal Reliability of Wafer-Level CSP

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Publisher: 50th Electronic Components and Technology Conference

Issue Date: 2000-05

Language: KOR

Citation: 50th Electronic Components and Technology Conference, v.0, no.0, pp.87 - 92

URI: http://hdl.handle.net/10203/136907

Appears in Collection: MS-Conference Papers(학술회의논문)

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