Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author 220
Showing results 11 to 70 of 87
| Combined analysis of moisture diffusion with interface fracture mechanics on the interface delamination in the plastic IC packages during reflow soldering Park, YB; Yu, Jin, Proceedings of the 1998 MRS Spring Symposium, v.515, pp.31 - 36, 1998-04-14 |
| Comparative Study of Thermally Conductive Fillers in Underfills Yu, Jin; Lee, WS; Lee, TY, 2004 ICEP Proceedings, pp.393 - 398, 2004 |
| Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application Yu, Jin; Sohn, YC; Jee, YK; Seo, HS; Kim, KH; Ahn, JH; Lee, YM, IMAPS 2005 Proceedings, 2005 |
| Compositional Factors that Enhance or Retard Temper Embrittlement Yu, Jin, Phil. Trans. Roy. Soc, pp.229 - 230, 1980-08-01 |
| Correlation between Zn Addition and Mechanical Reliability of Sn-3.5Ag-Xzn on Electroless Ni(P) / Au Pads Yu, Jin, ICEP2007, pp.197 - 204, 2007 |
| Crack TipPlasticity inCopper Single Crystal Yu, Jin, Multiscale Deformation and Fracture in Materials and Structures--- James R Rice 60th Anniversary Volume, pp.311 - 329, 2000-07-01 |
| Creep Deformation Behaviors of Tin Pest Resistant Solder Alloys Yu, Jin; Kim, SB; Sohn, YC, ICEP 2005, pp.196 - 201, 2005 |
| Creep Deformation of Microstructurally Stable Sn-3.5Ag-xBi Solders Yu, Jin; Shin, SW, Proc.3rd Electronic Materials and Packaging, pp.229 - 234, 2001 |
| Creep(소성변형 및 가공) 유진, Proc. Plastic Deformation and Working (Bando Pub. Co.), pp.340 - 367, 1988 |
| Cu-Cr/Polyimide 계의 계면 파괴 에너지에 관한 연구 Yu, Jin, 제12회 재료강도심포지엄, pp.479 - 485, 1998-01-01 |
| Cu/Cr/Polyimide 계의 파괴에너지에 관한 연구 유진; Park, YB; Park, IS, 제12회 재료강도심포지엄, pp.479 - 485, 1998 |
| Dislocation Pinning Effect of Grain Boundary Segregated Solute Atoms at Crack Tip Yu, Jin, Mat. Res. Soc. Symp. Proc., pp.361 - 366, 1988-07-01 |
| Effect of 85C/85% R.H. treatment on the Adhesion Strength of CuCr Alloy Films on Polyimide Yu, Jin, Proc. of the 2nd Pacific Rim Int. Conf. Adv. Mater. and Processiong (PRICM-2), pp.0 - 0, 1995-04-01 |
| Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations Jee, YK; Xia, YH; Yu, Jin; Kang, HW; Lee, TY, 58th Electronic Components and Technology Conference, ECTC 2008, pp.491 - 494, 2008-05-27 |
| Effect of alloying W in Ni(5P) metallization of solder joints Jang, DM; Yu, Jin, 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.141 - 144, 2008-10-22 |
| Effect of electrodeposition conditions on Kirkendall void formation between electrodeposited Cu film and Sn-3.5Ag solder Kim, JY; Yu, Jin; Lee, TY, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1620 - 1625, 2007-05-29 |
| Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.83 - 88, 2005-05-31 |
| Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging Jurenka, C; Kim, JY; Wolf, MJ; Engelmann, G; Ehrmann, O; Yu, Jin; Reichl, H, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.89 - 93, 2005-05-31 |
| Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin, 52nd Electronic Components and Technology Conference, 2002, pp.1221 - 1225, 2002-05-28 |
| Effects of P and Sn on the Creep of a 1%CrMoV Steel and of Iron-Based Model Alloys Yu, Jin; Jager, W; Grabke, HJ, Proceeding of 2nd International Conference on Creep and Fracture Engineering Materials and Structures, Pineridge Press., pp.649 - 659, 1984 |
| Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps Yu, Jin; Kim, JY; Jurenka, C; Wolf, J; Engelmann, G; Herbert Reichl, EMAP 2004 Proceedings, pp.373 - 378, 2004 |
| Effects of W addition in Ni(P) UBM on the solder joint reliability Jang, DM; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Estimation of the interfacial fracture energy of metal/polymer system in microelectronic packaging Song, JY; Yu, Jin, 2001 MRS Spring Meeting, v.682, pp.150 - 155, 2001-04-16 |
| Estimations of the Interfacial Fracture Energy of Metal Polymer System in Microelectronic Packaging Yu, Jin; Son, JY, MRS Proc., pp.N6.2.1 -, 2001 |
| Fabrication of multiwall carbon nanotube-nanocrystalline copper nanocomposite film by electrochemical deposition Yoo, JJ; Song, JY; Yu, Jin, Nanophase and Nanocomposite Materials V, pp.179 - 183, 2007-11-26 |
| Fracture mechanics analysis of the popcorn cracking in the plastic IC packages Park, YB; Yu, Jin, Proceedings of the 1997 21st IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, pp.12 - 19, 1997-10-13 |
| Fracture Mechanics Studies of the High Temperature Fracture at the KAIST Yu, Jin, pp.171 - 189, 1986-07-01 |
| Fracture Mechanics Studies of the High Temperature Fracture at the Korea Advanced Institute of Science and Technology 유진, ROK-ROC Workshop on Fracture of Metals at National Tsing Hua Univ.Taiwan, pp.171 - 189, 1986 |
| Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006 |
| Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19 |
| Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM Yu, Jin; Kim, JY; Sohn, YC, Micro System Technologies 2005 Proceedings, pp.337 - 344, 2005 |
| Investigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages Kim, SH; Kim, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.251 - 255, 2002-09-04 |
| Low resistance and Low temperature Bonding between Silver and Indium 유진; Cho, SI; Kim, YH, 2nd Int. Meeting on Information Display, pp.275 - 278, 2002 |
| Measurement of Metal/Polymer Interfacial Fracture energy in Microelectron in Packaging Yu, Jin; Song, JY, 3rd Electronics.Packaging Technology Conference(EPTC2000), pp.246 - 250, 2000-12-01 |
| Multi-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material Yoo, JJ; Song, JY; Yu, Jin; Lyeo, HK; Lee, S; Hahn, JH, 2008 58th Electronic Components and Technology Conference, ECTC, pp.1282 - 1286, 2008-05-27 |
| New Manufacturing Process for Flexible Printed Circuit Board (PCB) with Cu Conductive Lines of 5 μm pitch Lee, HJ; Yu, Jin; Lee, TY, 2003 International Symposium on Microelectronics, v.5288, pp.363 - 367, 2003-11-18 |
| NiCr강의 고온 파단 기구 유진; Hong, SH; Cho, HC, Proc. 2nd Conf. on Mechanical Behaviors, pp.121 - 125, 1988 |
| Nucleation of an Elliptic Dislocation Loop from a Crack Tip Yu, Jin, The Japan Institude of Metals, pp.399 - 402, 1994-06-01 |
| Overview of the Electronic Packaging Technologies in Korea Yu, Jin; Sohn, YC; Kim, JI, ICEP 2005, pp.4 - 8, 2005 |
| Phase transformation and residual stress evolution in electroless Ni-P UBM used in low cost flip chip technology Song, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.261 - 266, 2002-09-04 |
| Relaxation of Crack Tip Stresses by Diffusive Growth of Frain Boundary Cavities Yu, Jin; Jeon, JY, Proc. 5th Int. Conf. Strength of Materials(ICSMA-5), (The Japan Institute of Metals), pp.611 - 614, 1994-06-01 |
| Sn(or SnAg)/Ni(P)와 Sn/Cu 다층박막의 열사이클 동안 발생하는 잔류응력 과 미세구조의 변화 유진; Song, JY, 한국 마이크로전자 및 패키징학회, pp.265 - 269, 2003 |
| Sn-3.5Ag 솔더와 Ni/Cu UBM과의 반응 중 금속간화합물의 형성과 충격신뢰성과의 연관성에 관한 연구 유진; 김종연; 손윤철, IMAPS-Korea 2005 추계 기술심포지움, pp.3 - 6, 2005 |
| Sn-3.5Ag 솔더의 전단 크리프 특성 유진; Huang, ML; 김성범, IMAPS-Korea 2005 추계 기술심포지움, pp.96 - 99, 2005 |
| Sn-Ag 범프의 조성과 표면 형상에 미치는 도금 인자들에 관한 연구 유진, 한국마이크로전자 및 패키징학회, pp.106 - 109, 2003 |
| Spalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.177 - 181, 2004-01-05 |
| Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.75 - 81, 2004-06-01 |
| T Peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가(Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test) 유진; Song, JY, IMAPS Korea 2000 , Fall Symp. Dankuk Uni pp.107 - 111, 2000 |
| The effects of carbon and austenite stabilizing elements (Co, Cu, Ni and Mn) on the microstructural changes and the creep rupture strength in 9-12% Cr ferritic heat resistant steels Ryu, SH; Kim, MS; Lee, YS; Kim, JT; Yu, Jin; Lee, BJ, 4th International Conference on Advances in Materials Technology for Fossil Power Plants, v.2005, pp.1280 - 1298, 2004-10-25 |
| The Solder Joint and Runner Metal Reliability of Wafer-Level CSP 유진, 50th Electronic Components and Technology Conference, v.0, no.0, pp.87 - 92, 50th Electronic Components and Technology Conference, 2000-05 |
| The Solder Joint and Runner Metal Reliability of Wafer-Level CSP(Omega-CSP) Yu, Jin; Kang, IS; Kim, JH; Park, IS; Hur, KR; Cho, SJ; Han, H, 50th Electronic Components and Technology Conference(ECTC), pp.87 - 92, 2000 |
| Thermal behavior of Sn nanowires for nano-interconnection Shin, H; Song, J; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee, WS; Han, Y; Yu, Jin; Kim, SJ; Lee, TY, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.47 - 52, 2005-12-08 |
| Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process Yu, Jin; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001 |
| Variation of Fracture Mode in Temper Embrittled 2.25Cr-1Mo Steel Yu, Jin, pp.13 - 24, 1983-04-01 |
| ZrO2/Ag-Cu-Al-Ti에서 미세 구조가 계면 강도에 미치는 영향 유진; Lee, YM, 제 7회 재료강도 Symposium, pp.307 -, 1993 |
| 경도가 12%CrMoVNb 강의 크리프 성질에 미치는 영향 Yu, Jin; Lee, YS, 제12회 재료강도 심포지엄, pp.319 - 328, 1998-01-01 |
| 경도가 12CrMoVNb강의 크리프성질에 미치는 영향 유진; Lee, YS, 제 10회 재료강도심포지엄, pp.551 - 561, 1996 |
| 고온기기의 손상기구별 크립균열 전파특성 유진; Jeon, JY, 제 10회 재료강도심포지엄, pp.373 - 384, 1996 |
| 구리계 리드프레임/EMC 계면의 파괴거동(Fracture Behavior of Cu-based Leadfrrame/EMC Interfaces) 유진; Lee, HY, Conf. Mech. Beh. Mater., pp.43 - 52, 1999 |
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