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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Thermal behavior of Sn nanowires for nano-interconnection

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Shin, H / Song, J / Yu, Jinresearcher
Issue Date
2007-11-19
Language
ENG
Citation

International Conference on Electronic Materials and Packaging 2007, EMAP 2007

URI
http://hdl.handle.net/10203/156310
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MS-Conference Papers(학술회의논문)
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