Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 12541 to 12600 of 22813
| Modeling and analysis of a static var compensator using multilevel voltage source inverter Choi, Nam S.; Cho, Guk C.; Cho, Gyu-Hyeong, Proceedings of the 28th Annual Meeting of the IEEE Industry Applications Conference, v.2, pp.901 - 908, 1993-10-03 |
| Modeling and analysis of an energy-efficient sleep-mode operation in IEEE 802.16e system Chu,EM; Jung, BH; Sung, Dan Keun; Park, YJ, IEEE ICC 2012, IEEE, 2012-06 |
| Modeling and analysis of Buck-type three phase PWM rectifier by circuit DQ transformation Han, Soo-Bin; Choi, Nam-Sup; Rim, Chuntaek; Cho, Gyu-Hyeong, Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE, pp.431 - 436, IEEE, 1995-06 |
| Modeling and Analysis of CDMA Soft Handoff Sung, Dan Keun; Park, S; Cho, HS, IEEE Vehicular Technology Conference, pp.1525 - 1529, 1996 |
| Modeling and analysis of combined mobility management based on implicit cell update scheme in general packet radio service Chung, Y.W.; Sung, Dan Keun, 57th IEEE Semiannual Vehicular Technology Conference (VTC2003), v.57, no.1, pp.160 - 164, 2003-04-22 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; et al, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Modeling and analysis of millimeter/sub-millimeter wave indoor communications for multi-gigabit wireless transmission Choi, Yonghoon; Han, Youngnam, 39th International Conference on Infrared, Millimeter and Terahertz Waves, IRMMW-THz 2014, IEEE Computer Society, 2014-09 |
| Modeling and Analysis of Mis-Rounting Calls in Universal Personal Telecommunication Services in Fixed Networks Sung, Dan Keun; Chung, YW; Kwon, SJ, IEICE APCC 2001, pp.264 - 267, 2001-09 |
| Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; et al, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Modeling and analysis of power for System-on-a-Chip design Nair, I.I.; Shin, Youngsoo; Bergamaschi, R.A.; Bhattacharya, S; Darringer, J; Kosonocky, S, IBM Austin Conference on Energy-Efficient Design (ACEED), IBM, 2003-03 |
| Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter in 3DIC Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-06 |
| Modeling and Analysis of Return Paths of Common Mode EMI Noise Currents From Motor Drive System in Hybrid Electric Vehicle Kim, Joungho; Hongseok Kim; Jinwook Song; Younghwan Kwack; Dong-Hyun Kim; Eulyong Kim, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015-05-26 |
| Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface Shin, TaeIn; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Son, Keeyoung; Park, Gap Yeol; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity Shin, Taein; Park, Shinyoung; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Kim, Subin; Son, Kyungjune; et al, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.417 - 421, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Modeling and Design of Multi-loop Controlled Series Regulator Kim, MG; Choi, HC; Youn, Myung Joong, pp.335 - 340, 1991-10 |
| Modeling and experimental verification to investigate the effect of power supply noise imbalance on 900MHz differential LNA Koo, K.; Shim, J.; Shim, Y.; Kim, Joungho, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.343 - 346, IEEE, 2008-05-12 |
| Modeling and Inproved Current Control of Series Resonant Converter with Non-Periodic Integral Cycle Mode Ko, JH; Hong, SS; Kim, MG; Youn, Myung Joong, pp.745 - 751, 1991-06 |
| Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in Printed Circuit Boards (PCBs) Sung, H.; Kim, M.; Lee, W.; Yoon, C.; Koo, K.; Kwon, J.; Kim, Joungho, 12th Electronics Packaging Technology Conference, EPTC 2010, pp.773 - 776, EPTC 2010, 2010-12-08 |
| Modeling and Measurement of High-bandwidth and High-density Silicone Rubber Socket for 100Gbps Transceiver IC Test Park, Jun Yong; Kim, Hye Soo; Won, Hyo Sup; Kim, Jong Hoon; Bae, Bum Hee; Ha, Dong Ho; Bae, Michael; et al, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25 |
| Modeling and measurement of radiated emission through a cutout on the power/ground plane Lee, J.; Kang, J.; Park, K.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.776 - 780, IEEE, 2006-08-14 |
| Modeling and Predictive Current Control Technique for New Parallel Resonant Zero - Currrrent Switched Unity Power Factor Rectifier Moon, G.W.; Jo, B.R.; Ahn, H.W.; Youn, Myung Joong, International Sysposium on Industrial Electronics, 1992 |
| Modeling and predictive Current Control Technique for New zero Switched high Power Factor Rectifier Youn, Myung Joong; Moon, GW; Jo, BR; Ahn, HW, International Symposium on Industrial Electronics, pp.498 - 502, 1993-06 |
| Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Song, Kyunghwan; Kim, Joungho, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.223 - 227, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01 |
| Modeling and Simulation of a Disk Array System Park, Kyu Ho; Baek, Sung-Hoon; Kim, Kyung-Ho, Korea Information Science Society Fall Conference, 1998 |
| Modeling and Simulation of a Parallel Operating System : Processor Sharing Example Park, Kyu Ho; Hong, J.S.; Kim, T.G., IEEE Computer Society Press, '97 HPC Asia, pp.163 - 167, 1997 |
| Modeling and Simulation of EPON with Sleep Mode Enabled Using OPNET Fuad Yousif Mohammed, Alaelddin; Newaz, S.H.Shah; Choi, Jun Kyun, International Conference on ICT Convergence 2014 (ICTC 2014), pp.16 - 21, Korean Institute of Communications and Information Sciences, 2014-10-22 |
| Modeling and Simulation of FBAR devices Fabricated on Si Yoon, Giwan, 25th Int`l Conf. on the Physics of Semiconductors, pp.755 - 755, 2000-09 |
| Modeling and simulation of IC and package power/ground network Park, H.; Gam, D.G.; Kim, Joungho; Kim, H., 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.696 - 701, IEEE, 2006-08-14 |
| Modeling and simulation study of advanced read channels Moon, Jaekyun, International Magnetics Conference, pp.0 - 0, 1993-04-15 |
| Modeling and Target Classification Using Multiple Reflections of Sonar Kweon, In-So; Lee, Wangheon; Yoon, Kukjin, 2003 정보및 제어 학술대회, 2003-11 |
| Modeling and verification of 3-dimensional resistive storage class memory with high speed circuits for core operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Shinyoung; Park, Gap Yeol; Kim, Seongguk; Shin, Taein; et al, 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019, pp.694 - 696, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle Kim, Subin; Shin, Taein; Jeong, Seungtaek; Kang, Hyungmin; Son, Keeyoung; Park, Shinyoung; Kim, Hyunho; et al, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.287 - 292, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Modeling and Verification to Analyze Effect of Power/Ground Noises on CMOS Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae; Shim, Jongjoo, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Modeling and verification to analyze effect of power/ground noises on CMOS feedback operational amplifier Shim, Y.; Park, J.; Shim, J.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 7, IEEE, 2007-07-09 |
| Modeling Auditory Pathway for Feature Extraction, Binaural Processing and Top-Down Attention Lee, Soo-Young, Telluride Neuromorphic Engineering Workshop, pp.0 - 0, 2006-06 |
| Modeling Auditory Pathway for Robust Speech Recognition(Plenary Talk) Lee, Soo-Young, Proc. of the 2nd International Conference on Speech Sciences(ICSS 2004), pp.121 - 127, 2004 |
| Modeling brain hierarchical structure using graph-based manifold learning Lim, Woosang; Lee, Jungsoo; Lim, Yongsub; Jung, Kyomin; KIM, DAE SHIK, Society for Neuroscience Annual Meeting 2015, Society for Neuroscience Annual Meeting 2015, 2015-10-18 |
| Modeling Cache Memory in Multiprocessor Systems Using DEVS Framework Kim, Tag-Gon; Lee, Kyou H.; Lee, Won H., 1992 European Simulation Multiconference, pp.368 - 373, 1992-06 |
| Modeling Human Auditory Pathway for Feature Extraction, Binaural Processing and Top-Down Attention Lee, Soo-Young, APCTP Workshop-Physics of Hearing and Neurons Meets Nanoelectromechanics, APCTP, 2010-08-02 |
| Modeling human auditory perception for noise-robust speech recognition Lee, Soo-Young, 2005 International Conference on Neural Networks and Brain Proceedings, ICNNB'05, v.1, pp.0 - 0, 2005-10-13 |
| Modeling interconnect corners under double patterning misalignment Hyun, Dai Joon; Shin, Young Soo, SPIE Advanced Lithography, SPIE, 2016-02-24 |
| Modeling method for set of genes based on steady state and transition probability of codon Han, GyuBum; Cho, Dong Ho, ISIR 2016, ISIR 2016, 2016-07-15 |
| Modeling neuro-type dependent differences of BOLD fMRI Park, Sun Mi; Kang, yuk; Kim, Dae-Shik, Organization for Human Brain Mapping 2012, 2012-06-10 |
| Modeling of a Field Emission Display using the Adaptive scheme method Choi, Kyung Cheol, , 1994-10 |
| Modeling of a Fuzzy Production System and its Inference Engine:Fuzzy Petri Nets Approach 변증남, 한국퍼지시스템학회 추계학술대회, pp.133 - 144, 1991 |
| Modeling of a Multimachine Power System and Design of a Robust Adaptive Power System Stabilizer Shin, Jin-Ho; Lee, Ju-Jang, KIEE Tajoen Branch Conference, pp.43 - 49, KIEE, 1998-12 |
| Modeling of an Elastomer Constitutive Relation 성단근, 한국자동제어학술회의, pp.1018 - 1021, 1988-12 |
| Modeling of Chip Level Power Distribution Network Based on Segmentation Method Kim, Joungho; Kim, Jaemin; Shim, Yujeong; Song, Eakhwan; Koo, Kyungchul, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Modeling of Chip-Package-PCB Hierarchical Power Distribution Network based on Segmentation Method Kim, Jaemin; Shim, Jongjoo; Pak, Junso; Kim, Joungho, Electrical Design of Advanced Packaging and Systems Symposium, 2008. EDAPS 2008., pp.85 - 88, IEEE, 2008-12-11 |
| Modeling of Current Degradation in Hot-Eletron Damaged LDD NMOSFETs Ytterdal, T.; Kim, S-H.; Min, K-S.; Lee, Kwyro; Fjeldly, T.A., 2nd Int. Device Reseach Symposium, pp.261 - 264, 2nd Int. Device Reseach Symposium, 1993-12 |
| Modeling of eigenvalues for MIMO channel capacity based on outdoor measurements Kim, W.; Lee, HyuckJae; Park, J.J.; Kim, M.-D.; Chung, H.K., VTC Spring 2009 - IEEE 69th Vehicular Technology Conference, pp.1 - 5, IEEE, 2009-04-26 |
| Modeling of Electromagnetic Interference Shielding Materials in Wireless Power Transfer for Board-to-Board Level Interconnections 김정호; 김석진; 정현석; 김종훈; 배범희; 공선규; 송치억, IEEE Wireless Power Transfer Conference 2014(WPTC2014), IEEE Wireless Power Transfer Conference 2014(WPTC2014), 2014-05-08 |
| Modeling of Frame Difference Image Based on Ridge-signal and Application to Low-rate Video Data Compression Kim, Seong-Dae; Jang, SH, Proceeding of ISITA, pp.547 - 550, 1990 |
| Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation Kim, J.; Jeong, Y.; Kim, J.; Lee, J.; Shim, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19, IEEE, 2006-08-14 |
| Modeling of Interaction with the Environment Using Sensor Inputs in Human-friendly Software Robot Lee, Joon-Yong; Kim, Chang-Hyun; Lee, Ju-Jang, KACC, pp.582 - 585, KACC, 2005-10 |
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