Modeling of Chip-Package-PCB Hierarchical Power Distribution Network based on Segmentation Method
- Publisher
- IEEE
- Issue Date
- 2008-12-11
- Language
- Korean
- Citation
Electrical Design of Advanced Packaging and Systems Symposium, 2008. EDAPS 2008., pp.85 - 88
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
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