DSpace at KOASAS: Modeling and analysis of die-to-die vertical coupling in 3-D IC

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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Modeling and analysis of die-to-die vertical coupling in 3-D IC

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Lee, S. / Kim, G. / Kim, J. / Song, T. / Lee, J. / Lee, H. / Park, K. / Kim, Joungho researcher

Issue Date: 2009-12-09

Language: ENG

Citation: 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711

URI: http://hdl.handle.net/10203/163289

Appears in Collection: EE-Conference Papers(학술회의논문)

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