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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Modeling and analysis of die-to-die vertical coupling in 3-D IC

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dc.contributor.authorLee, S.-
dc.contributor.authorKim, G.-
dc.contributor.authorKim, J.-
dc.contributor.authorSong, T.-
dc.contributor.authorLee, J.-
dc.contributor.authorLee, H.-
dc.contributor.authorPark, K.-
dc.contributor.authorKim, Joungho-
dc.date.accessioned2013-03-28T05:57:43Z-
dc.date.available2013-03-28T05:57:43Z-
dc.date.created2012-02-06-
dc.date.issued2009-12-09-
dc.identifier.citation2009 11th Electronic Packaging Technology Conference, EPTC 2009, v., no., pp.707 - 711-
dc.identifier.urihttp://hdl.handle.net/10203/163289-
dc.languageENG-
dc.titleModeling and analysis of die-to-die vertical coupling in 3-D IC-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77950931420-
dc.type.rimsCONF-
dc.citation.beginningpage707-
dc.citation.endingpage711-
dc.citation.publicationname2009 11th Electronic Packaging Technology Conference, EPTC 2009-
dc.identifier.conferencecountrySingapore-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorLee, S.-
dc.contributor.nonIdAuthorKim, G.-
dc.contributor.nonIdAuthorKim, J.-
dc.contributor.nonIdAuthorSong, T.-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorLee, H.-
dc.contributor.nonIdAuthorPark, K.-
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EE-Conference Papers(학술회의논문)
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