Modeling and verification of 3-dimensional resistive storage class memory with high speed circuits for core operation

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In this paper, we, for the first time, propose the modeling and verification of 3-dimensional storage class memory (SCM) using new memory with high speed circuits for core operation. For the memory analysis with the simulation, the RC model of interconnections and core operation circuit models are combined in the same simulation environment. Therefore, we modeled the memory elements using passive resistances and voltage controlled switches in circuit simulation system for compatibility. To verify the proposed model, we compared the characteristics of the memory cell with the behavior model which verified to the experimental data. The overall characteristics of memory cell model are similar with the conventional behavior model. In addition, we simulated the core operation of 3-dimensional resistive SCM with the proposed models and verify the applicability in time-domain.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Issue Date
2019-12
Language
English
Citation

2019 IEEE Asia-Pacific Microwave Conference, APMC 2019, pp.694 - 696

DOI
10.1109/APMC46564.2019.9038362
URI
http://hdl.handle.net/10203/310794
Appears in Collection
EE-Conference Papers(학술회의논문)
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