Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation

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Publisher
IEEE
Issue Date
2006-08-14
Language
ENG
Citation

2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19

URI
http://hdl.handle.net/10203/18662
Appears in Collection
EE-Conference Papers(학술회의논문)
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Manuscript_EMC2006_Jaemin_Kim.pdf(385.05 kB)Download

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