DSpace at KOASAS
College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel

Cited 4 time in webofscience Cited 5 time in scopus
  • Hit : 348
  • Download : 1348
Export
Kim, Jounghoresearcher / Jung, Daniel H / Kim, Heegon / Kim, Jonghoon J / Bae, Hyun-Cheol / Choi, Kwangseong
Publisher
IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo)
Issue Date
2013-12-15
Language
English
Citation

IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166

DOI
10.1109/EMCCompo.2013.6735193
URI
http://hdl.handle.net/10203/188148
Appears in Collection
EE-Conference Papers(학술회의논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 4 items in WoS Click to see citing articles in records_button

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0