Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Paik, Kyung-Wook
Showing results 1 to 60 of 529
| 20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wook, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21 |
| 20％ Ni maraging 강의 기계적 성질과 석출현상에 대한 Nb 영향 = The effects of Nb on mechanical properties and precipitation behavior of 20％ Ni maraging steellink 백경욱; Paik, Kyung-Wook; et al, 한국과학기술원, 1981 |
| 3D TSV Vertical Interconnection Using NCF Materials Paik, Kyung-Wook; Choi,Yong-Woon; Shin , Ji-Won, 2014 Pan Pacific Microelectronics Symposium, 2014 Pan Pacific Microelectronics Symposium, 2014-02-11 |
| 3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs) Choi, Yongwon; Shin, Jiwon; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, ECTC, 2012-05 |
| 3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs) Paik, Kyung-Wook; Choi, Yongwon; Shin, Jiwon, 2013 Pan Pacific Microelectronics Symposium, 2013 Pan Pacific Microelectronics Symposium, 2013-01-23 |
| A Novel Double Layer NCF for Highly Reliable Micro-Bump Interconnection Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano -particles Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis Liu, Jinhong; Hua, Yaling; Liu, Junfu; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, SURFACES AND INTERFACES, v.44, 2024-01 |
| A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates Kim, JS; Paik, Kyung-Wook; Seo, HS, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.4, pp.638 - 641, 1999-11 |
| A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03 |
| A study on B-stage CNT/epoxy composite films for electronic packaging applications Paik, Kyung-Wook; Han, SH, 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, pp.2755 - 2758, Materials Australia, 2010-08-02 |
| A study on characteristics and processing parameters of photo-patternable adhesives for MEMS Motion Sensor Wafer Bonding = MEMS 모션센서 웨이퍼 본딩을 위한 감광성 접착제의 특성과 공정변수에 관한 연구link Kim, Jong-Hyun; 김종현; et al, 한국과학기술원, 2011 |
| A study on coining processes of solder bumps on organic substrates Nah, JW; Paik, Kyung-Wook; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04 |
| A Study on Copper-to-Copper Contacts in NMBITM(Neo-Manthattna Bump Interconnection Structure) Kim, HJ; Paik, Kyung-Wook; Lee, SG; Han, JW; Hwang, JH; Lee, SM, 6th International Conference on Electronic Materials and Packaging, pp.0 - 0, 2004-12-01 |
| A study on dielectric constants of epoxy/SrTiO3 composite for embedded capacitor films (ECFs) Lee, Sangyong; Hyun, Jin-Gul; Kim, Hyungsoo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.3, pp.428 - 433, 2007-08 |
| A study on epoxy/BaTiO3 embedded capacitor pastes for organic substrates Jang, KW; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.1504 - 1509, IEEE, 2006-05-30 |
| A study on Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method Jung, Seung-Yoon; Hong, Hye-Eun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1265 - 1271, 2017-08 |
| A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
| A study on material properties and reliability of Epoxy/ $BaTiO_3$ Embedded Capacitor Films (ECFs) in organic substrates = 유기기판용 에폭시/ $BaTiO_3$ 내장형 커패시터 필름의 재료 물성 및 신뢰성에 관한 연구link Lee, Sang-Yong; 이상용; et al, 한국과학기술원, 2010 |
| A Study on Nano-sized Silica Content and Size Effect in Non Conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection Lee, HanMin; Lee, SeYong; Cho, SeMin; Park, Jong-Ho; Paik, Kyung-Wook, 2017 IEEE 67th Electronic Components and Technology Conference, IEEE-CPMT, 2017-05-31 |
| A Study on Nano-Sized Silica Contents and Size Effect in Non-conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection Lee, Hanmin; Lee, Seyong; Cho, Semin; Yu, Younghyun; Park, Jongho; Paik, Kyung-Wook, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, pp.399 - 404, Institute of Electrical and Electronics Engineers Inc., 2017-05 |
| A Study on Nanofiber Anisotropic Conductive Films (ACFs) for Fine Pitch Chip-on-Glass (COG) Interconnections Lee, Sang Hoon; Kim, Tae Wan; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29 |
| A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection Song, Lu; Yoon, Dal-Jin; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.368 - 377, 2020-03 |
| A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs) Choi, Y; Shin, J; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1126 - 1129, ECTC, 2011-05-31 |
| A study on the adhesion enhancement of polyetherimide to Si wafer using an Al-chelate treatment during multichip module fabrication Ko, HS; Chung, IS; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY , v.83, no.1-3, pp.111 - 118, 2001-06 |
| A study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with self-exposed conductive particles surface for ultra-fine pitch Chip-on-Glass (COG) applications Yoon, Dal-Jin; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2266 - 2271, IEEE, 2019-05 |
| A study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Flex-on-Flex (FOF) assembly using an Ultrasonic bonding method Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.15 - 20, IEEE-CPMT, 2018-05-30 |
| A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications Zhang, Shuye; Lin, Tiesong; He, Peng; Zhao, Ning; Huang, Mingliang; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12 |
| A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-mu m Fine-Pitch Interconnection Lee, Sang-Hoon; Yoon, Dal-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.209 - 215, 2019-02 |
| A Study on the Curing properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly Lee, Hanmin; Lee, Seyong; Park, Jong-Ho; Chung, Chang-Kyu; Jang, Kyung-Woon; Kim, Il; Choi, SeongWoo; et al, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2464 - 2469, IEEE-CPMT, 2018-06-01 |
| A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06 |
| A Study on the Dynamic Bending Reliability of Chip-in-Fabrics(CIF) Packages Using Anisotropic Conductive Films (Acfs) Materials for Flexible Electronic Applications Jung, Seung-Yoon; Paik, Kyung-Wook, 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020, Institute of Electrical and Electronics Engineers Inc., 2020-02 |
| A study on the effects of anisotropic conductive film (ACF) properties on interconnection stability of ACF flip-chip assemblies = 이방성 전도성 필름 특성이 플립칩 어셈블리의 접속 안정성에 끼치는 영향에 대한 연구link Chung, Chang-Kyu; 정창규; et al, 한국과학기술원, 2010 |
| A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film(ACF) for LCD Packaging Applications Paik, Kyung-Wook; Yim, MJ; Kim, YK; Hwang, HN, InterPACK'97, pp.65 - 72, 1997-06-01 |
| A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films Jung, Seung-Yoon; Oh, Seung Jin; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.1, pp.176 - 183, 2020-01 |
| A Study on the Fabrication of Electrical Circuits on Fabrics using Cu Pattern Laminated B-stage Adhesive Films for Electronic Textile Applications Jung, Seung-Yoon; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2145 - 2150, IEEE-CPMT, 2017-06-01 |
| A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.216 - 223, 2016-02 |
| A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive Films (NCFs) for 3D-TSV Vertical Interconnection Choi, Yong-Won; Shin, Ji-Won; Kim, Young Soon; Suk, Kyung-lim; Kim, Il; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-compression Bonding Method Lee, JiSoo; Kim, Jihye; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2168 - 2174, IEEE-CPMT, 2017-06-01 |
| A Study on the Flexible Chip-on-Fabric (COF) Assembly using Anisotropic Conductive Films (ACFs) Materials Jung, Seung-Yoon; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.283 - 288, IEEE, 2019-05 |
| A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates Jung, Seung-Yoon; Lee, Tae-Ik; Cho, Minsun; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367, 2020-03 |
| A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05 |
| A study on the interfacial adhesion mechanism of thermoplastic anchoring polymer layer(APL) films and epoxy-based nonconductive film(NCF) for APL ACFs = APL ACF 용 열가소성 앵커링 폴리머 층 (APL) 필름과 에폭시 기반 비전 도성 필름 (NCF)의 계면 접착 메커니즘에 관한 연구link KANG, QI; Paik, Kyung-Wook; et al, 한국과학기술원, 2020 |
| A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties Byeon, Jun-Ho; Yoon, Dal Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.7, pp.1235 - 1243, 2019-07 |
| A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications Lee, Sang Hoon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174, 2017-01 |
| A STUDY ON THE NOVEL ANCHORING POLYMER LAYER(APL) ANISOTROPIC CONDUCTIVE FILMS(ACFs) FOR ULTRA FINE PITCH ASSEMBLY APPLICATIONS Paik, Kyung-Wook; Yoon, Dal-Jin, Pan Pacific Microelectronics Symposium (Pan Pacific), IEEE, 2018-02 |
| A study on the novel Nylon Anchoring Polymer Layer(APL) Anisotropic Conductive Films(ACFs) for Ultra Fine pitch Chip-on-Glass(COG) applications Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1113 - 1118, IEEE-CPMT, 2017-05-31 |
| A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature Zhang, Shuye; Yang, Ming; Wu, Yang; Du, Jikun; Lin, Tiesong; He, Peng; Huang, Mingliang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03 |
| A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films Zhang, Shuye; Huang, Mingliang; Wu, Yang; Yang, Ming; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2022 - 2028, IEEE, 2019-05 |
| A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging Zhang, Shuye; Yang, Ming; Zhang, Yanxin; Wang, Qian; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12 |
| A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives Zhang, Shuye; Qi, Xiaoquan; Yang, Ming; Cao, Yang; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183, 2019-05 |
| A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding Zhang, Shuye; Kim, Seung-Ho; Kim, Tae-Wan; Kim, Yoo Sun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.9 - 14, 2015-01 |
| A study on the temperature dependence of epoxy/BaTiO3 composite embedded capacitor films Hyun, JG; Cho, SD; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1264 - 1269, 2005-09 |
| A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates Son, Ho-Young; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1832 - 1842, 2008-12 |
| A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06 |
| A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection Zhang, Shuye; Park, Junyong; Park, Gapyeol; Kim, Joungho; Paik, Kyung-Wook; He, Peng, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
| A thermomechanical analysis of MCM-D substrate of polymer and metal multilayer Lim, JH; Kim, JS; Paik, Kyung-Wook; Earmme, Youn-Young, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.1123 - 1128, 2000 |
| (A) study on CNT / epoxy composite films = 탄소나노튜브 / 에폭시 복합필름에 관한 연구link Han, Seung-Hun; 한승훈; et al, 한국과학기술원, 2008 |
| (A) study on effects of non-conductive films(NCFs) material properties and bonding parameters on Cu-pillar/Sn-Ag hybrid bump interconnection using thermo-compression bonding = 구리/주석-은 하이브리드 범프 접합시 열압착 접합 공정에서 비전도성 접속 필름의 물성과 접합 변수의 영향에 대한 연구link Jang, Min-Gu; Paik, Kyung-Wook; et al, 한국과학기술원, 2020 |
| (A) study on epoxy die attach films(DAFs) for chip stacking = 칩 적층을 위한 에폭시계 Die attach films(DAFs) 에 관한 연구link Choi, Yong-Won; 최용원; et al, 한국과학기술원, 2009 |
Discover
Open Access
Date issued
- 2,230 2020 - 2024
- 6,675 2010 - 2019
- 5,356 2000 - 2009
- 3,582 1990 - 1999
- 982 1980 - 1989