A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-compression Bonding Method

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Publisher
IEEE-CPMT
Issue Date
2017-06-01
Language
English
Citation

2017 IEEE 67th Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/223715
Appears in Collection
MS-Conference Papers(학술회의논문)
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