3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs)
- Publisher
- ECTC
- Issue Date
- 2012-05
- Language
- English
- Citation
The 62nd Electronic Components and Technology Conference
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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- There are no files associated with this item.
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