20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives

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Issue Date
2009-10-21
Language
ENG
Citation

IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59

URI
http://hdl.handle.net/10203/154026
Appears in Collection
MS-Conference Papers(학술회의논문)
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