A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling

Abstract

A study of the failure mechanism and the enhanced reliability performance of SnBi58 solder ACF joints were investigated by considering the total influence of polymer viscoelastic and hygroscopic properties on the cross-sectional morphologies and the electrical properties of Sn58Bi solder joints in a pressure cooker test (PCT) for 120 h. The Sn58Bi solder failure mechanism is demonstrated that, when polymer resin absorbed moisture, the T-g values of polymer resins decreased, and the coefficient of thermal expansion (CTE) values of polymer resins increased, due to a hydroswelling effect. Considering the total influence of polymer viscoelastic and hygroscopic properties on the cross-sectional morphologies and the reliability of Sn58Bi solder joints in a PCT for 120 h, four typical polymer resins were evaluated. As a result, cationic epoxy (128 ppm/degrees C) with the smallest CTE mismatch (112 ppm/degrees C) with SnBi58 solder joints (16 ppm/degrees C) in a PCT aging test (121 degrees C, 100% humidity, and 2 atm) showed a stable electrical property in terms of joint contact resistance and remained a complete cross-sectional Sn58Bi solder joint morphology after PCT reliability for 120 h.