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Paik, Kyung-Wook (백경욱)
교수, (신소재공학과)
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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
    1
    Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating

    Zhang, Shuai; Zhang, Shuye; Zhou, Hongzhi; et al, MATERIALS CHARACTERIZATION, v.207, 2024-01

    2
    In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

    Liu, Jinhong; Xu, Jianhao; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.169, pp.42 - 52, 2024-01

    3
    Equilibrium phase diagram design and structural optimization of SAC/ Sn-Pb composite structure solder joint for preferable stress distribution

    Xu, Sunwu; Jing, Xinyi; Zhu, Pengyu; et al, MATERIALS CHARACTERIZATION, v.206, 2023-12

    4
    The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates

    Zhang, Shuye; Wang, Shaoan; Zhang, Shang; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11

    5
    The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

    Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11

    6
    Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks

    Jing, Xinyi; Luo, Keyu; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.26, pp.1663 - 1668, 2023-09

    7
    The preparation of anisotropic conductive paste and its application in FOB interconnection

    Cai, Xionghui; Zhai, Aixia; Zhou, Chenglong; et al, MICROELECTRONICS INTERNATIONAL, v.40, no.2, pp.166 - 171, 2023-03

    8
    Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads

    Zhang, Shuye; Sun, Mingjia; Yang, Jianqun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.1, pp.26 - 33, 2023-01

    9
    Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package

    Zhang, Shuye; Duan, Ran; Xu, Sunwu; et al, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06

    10
    A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection

    Zhang, Shuye; Park, Junyong; Park, Gapyeol; et al, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06

    11
    Cu-Cu joining using citrate coated ultra-small nano-silver pastes

    Zhang, Shuye; Wang, Qian; Lin, Tiesong; et al, JOURNAL OF MANUFACTURING PROCESSES, v.62, pp.546 - 554, 2021-02

    12
    Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air

    Wang, Qian; Zhang, Shuye; Lin, Tiesong; et al, PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, v.31, no.1, pp.129 - 140, 2021-02

    13
    ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics

    Yoon, Dal-Jin; Malik, Muhammad-Hassan; Yan, Pan; et al, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292, 2021-01

    14
    Acoustic Matching Layer Films Using B-Stage Thermosetting Polymer Resins for Ultrasound Transducer Applications

    Park, Jae-Hyeong; Lee, Sang-Mok; Park, Jongcheol; et al, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.67, no.10, pp.2148 - 2154, 2020-10

    15
    Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

    Tian, Ye; Fang, Heng; Ren, Ning; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07

    16
    A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films

    Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06

    17
    Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps

    Lee, Hanmin; Lee, Seyong; Choi, Taejin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05

    18
    A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates

    Jung, Seung-Yoon; Lee, Tae-Ik; Cho, Minsun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367, 2020-03

    19
    A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection

    Song, Lu; Yoon, Dal-Jin; Zhang, Shuye; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.368 - 377, 2020-03

    20
    A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films

    Jung, Seung-Yoon; Oh, Seung Jin; Lee, Tae-Ik; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.1, pp.176 - 183, 2020-01

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