학위논문(석사) - 한국과학기술원 : 신소재공학과, 2020.2,[vi, 61 p. :]
Non-conductive adhesive films(NCFs)▼aUltra fine pitch micro bump▼aHigh speed thermo-compression bonding▼aThermo-compression gang bonding▼aSolder joint morphology; 비전도성 접속 필름▼a극미세피치 마이크로 범프▼a고속 열압착 본딩▼a열압착 갱본딩▼a솔더 형상
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