A Study on Nano-sized Silica Content and Size Effect in Non Conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

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Publisher
IEEE-CPMT
Issue Date
2017-05-31
Language
English
Citation

2017 IEEE 67th Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/223721
Appears in Collection
MS-Conference Papers(학술회의논문)
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