A Study on Nano-sized Silica Content and Size Effect in Non Conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection
- Publisher
- IEEE-CPMT
- Issue Date
- 2017-05-31
- Language
- English
- Citation
2017 IEEE 67th Electronic Components and Technology Conference
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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