Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Chun , Soung Soon
Showing results 1 to 24 of 24
| A comparative-Evaluation Method Of Machinability For Mica-Based Glass-Ceramics Baik, DS; No, Kwangsoo; Chun , Soung Soon; Yoon, YJ; Cho, HY, JOURNAL OF MATERIALS SCIENCE, v.30, no.7, pp.1801 - 1806, 1995-04 |
| CHARACTERIZATION OF PBTIO3 THIN-FILMS DEPOSITED ON PT/TI/SIO2/SI SUBSTRATES BY ECR PECVD CHUNG, SW; SHIN, JS; KIM, JW; No, Kwangsoo; Chun , Soung Soon; Lee, Won-Jong, JOURNAL OF MATERIALS RESEARCH, v.10, no.2, pp.447 - 452, 1995-02 |
| Chemical vapor deposition of titanium carbide on AlSl M2 tool steels and Si3N4-TiC ceramic composite Kang, C.J.; Kim, D.W.; Park, Chong-Ook; Chun , Soung Soon, MATERIALS AND MANUFACTURING PROCESSES, v.5, no.1, pp.63 - 78, 1990 |
| COMPOSITIONAL AND STRUCTURAL-ANALYSIS OF ALUMINUM-OXIDE FILMS PREPARED BY PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION KIM, YC; PARK, HH; Chun , Soung Soon; Lee, Won-Jong, THIN SOLID FILMS, v.237, no.1-2, pp.57 - 65, 1994-01 |
| Copper chemical vapour deposition using copper(I) hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Min, JS; Rha, SK; Chun , Soung Soon; Park, Chong-Ook; Kim, DW, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.2, pp.111 - 117, 1996-04 |
| Dependence of oxygen redistribution on titanium film thickness during titanium silicide formation by rapid thermal annealing Kang, S.W.; Park, Sin Chong; Chun , Soung Soon, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, v.7, no.6, pp.3246 - 3250, 1989-11 |
| Deposition Characteristics and Microstructure of the High Tc Superconducting YBa2Cu3O7-x Thin Films Prepared by MOCVD Kim, Sang Ho; Cho, Chang Hyun; No, Kwangsoo; Chun , Soung Soon, JOURNAL OF MARINE RESEARCH, v.6, no.4, pp.704 - 711, 1990-12 |
| EFFECTS OF ANNEALING IN O-2 AND N-2 ON THE ELECTRICAL-PROPERTIES OF TANTALUM OXIDE THIN-FILMS PREPARED BY ELECTRON-CYCLOTRON-RESONANCE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION Kim, IL; Kim, Jong-Seok; Kwon, Oh-Seung; Ahn, Sung-Tae; Chun , Soung Soon; Lee, Won-Jong, JOURNAL OF ELECTRONIC MATERIALS, v.24, no.10, pp.1435 - 1441, 1995-10 |
| EFFECTS OF DEPOSITION RATE ON THE ENCROACHMENT IN TUNGSTEN FILMS REDUCED BY H-2 PARK, YW; KIM, IL; Park, Chong-Ook; Chun , Soung Soon, JOURNAL OF MATERIALS SCIENCE, v.26, no.19, pp.5318 - 5322, 1991-10 |
| EFFECTS OF DEPOSITION TEMPERATURE AND ANNEALING PROCESS ON THE SUPERCONDUCTING PROPERTIES OF YBA2CU3O7-X THIN-FILMS PREPARED BY METAL ORGANIC-CHEMICAL VAPOR-DEPOSITION KIM, SH; Cho, CH; Kim, DW; No, Kwangsoo; Chun , Soung Soon, THIN SOLID FILMS, v.214, no.2, pp.229 - 234, 1992-07 |
| EFFECTS OF DEPOSITION TEMPERATURE ON THE ELECTRICAL-PROPERTIES OF ELECTRON-CYCLOTRON-RESONANCE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION TA2O5 FILM AND THE FORMATION OF INTERFACIAL SIO2 KIM, I; KIM, JS; CHO, BW; AHN, SD; Chun , Soung Soon; Lee, Won-Jong, JOURNAL OF MATERIALS RESEARCH, v.10, no.11, pp.2864 - 2869, 1995-11 |
| Effects of Deposition Temperature on the microstructure of MOCVD Y1Ba2Cu3O7-x Thin-Films Cho, CY; Hwang, D; No, Kwangsoo; Chun , Soung Soon; Kim, SH, JOURNAL OF MATERIALS SCIENCE, v.28, no.11, pp.2915 - 2922, 1993-06 |
| Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11 |
| LOW-PRESSURE CHEMICAL VAPOR-DEPOSITION OF BLANKET TUNGSTEN USING A GASEOUS MIXTURE OF WF6, SIH4, AND H2 PARK, HL; YOON, SS; Park, Chong-Ook; Chun , Soung Soon, THIN SOLID FILMS, v.181, no.1, pp.85 - 93, 1989-12 |
| MECHANICAL-PROPERTIES OF MICA GLASS-CERAMICS Baik, DS; No, Kwangsoo; Chun , Soung Soon, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.78, no.5, pp.1217 - 1222, 1995-05 |
| PITTING RESISTANCE OF TIN DEPOSITED ON INCONEL-600 BY PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION In, C.B.; Kim, S.P.; Kim, Y.I.; Kim, W.W.; Kuk, I.H.; Chun , Soung Soon; Lee, Won-Jong, JOURNAL OF NUCLEAR MATERIALS, v.211, no.3, pp.223 - 230, 1994 |
| PROPERTIES OF ALUMINUM-OXIDE FILMS PREPARED BY PLASMA-ENHANCED METAL ORGANIC-CHEMICAL VAPOR-DEPOSITION KANG, CJ; Chun , Soung Soon; Lee, Won-Jong, THIN SOLID FILMS, v.189, no.1, pp.161 - 173, 1990-08 |
| Reactive ion etching mechanism of copper film in chlorine-based electron cyclotron resonance plasma Lee, SK; Chun , Soung Soon; Hwang, CY; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.1A, pp.50 - 55, 1997-01 |
| THE ADHESION OF LOW-PRESSURE CHEMICALLY VAPOR-DEPOSITED TUNGSTEN FILMS ON SILICON AND SIO2 FOR SIH4-H2-WF6 AND H2-WF6 PROCESSES PARK, YW; Park, Chong-Ook; Chun , Soung Soon, THIN SOLID FILMS, v.201, no.1, pp.167 - 175, 1991-06 |
| THE EFFECT OF AMORPHOUS-SILICON CAPPING ON TITANIUM DURING TISI2 FORMATION BY RTA Kang, Sang-Won; Park, Sin Chong; Chun , Soung Soon, JOURNAL OF MATERIALS SCIENCE, v.25, no.1A, pp.98 - 102, 1990-01 |
| THE EFFECTS OF CHLORINE CONTENT ON THE PROPERTIES OF TITANIUM CARBONITRIDE THIN-FILM DEPOSITED BY PLASMA ASSISTED CHEMICAL VAPOR-DEPOSITION KIM, SB; Choi, Si-Kyung; Chun , Soung Soon; KIM, KH, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.9, no.4, pp.2174 - 2179, 1991-07 |
| THE EFFECTS OF DEPOSITION TEMPERATURE ON THE INTERFACIAL PROPERTIES OF SIH4 REDUCED BLANKET TUNGSTEN ON TIN GLUE LAYER LEE, YJ; Park, Chong-Ook; KIM, DW; Chun , Soung Soon, JOURNAL OF ELECTRONIC MATERIALS, v.23, no.10, pp.1075 - 1080, 1994-10 |
| THE EFFECTS OF METALLIC INTERLAYER FORMATION ON THE ADHESION PROPERTIES OF PACVD-TIN FILMS ON TOOL STEEL KIM, SB; IN, CB; Choi, Si-Kyung; Chun , Soung Soon, JOURNAL DE PHYSIQUE II, v.1, no.C2, pp.609 - 616, 1991-09 |
| The effects of substrate temperature and lead precursor flow rate on the fabrication of (Pb,La)(Zr,Ti)O-3 thin films by electron cyclotron resonance plasma-enhanced chemical vapor deposition Shin, JS; Chun , Soung Soon; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.4A, pp.2200 - 2206, 1997-04 |
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