Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject TECHNOLOGY

Showing results 1 to 43 of 43

1
A microfluidic system incorporated with peptide/Pd nanowires for heterogeneous catalytic reactions

Ryoo, Hyang-Im; Lee, Joon-Seok; Park, Chan-Beum; Kim, Dong-Pyo, LAB ON A CHIP, v.11, no.3, pp.378 - 380, 2011

2
A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

Lee, Sang Hoon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174, 2017-01

3
Acoustic wave-based NO(2) sensor: Ink-jet printed active layer

Jung, Woo Chul; Sahner, K.; Leung, A.; Tuller, H. L., SENSORS AND ACTUATORS B-CHEMICAL, v.141, no.2, pp.485 - 490, 2009-09

4
Basilar membrane-inspired self-powered acoustic sensor enabled by highly sensitive multi tunable frequency band

Han, Jae Hyun; Kwak, Jun-Hyuk; Joe, Daniel Juhyung; Hong, Seong Kwang; Wang, Hee Seung; Park, Jung Hwan; Hur, Shin; et al, NANO ENERGY, v.53, pp.198 - 205, 2018-11

5
Carbon nanotube-based membranes: Fabrication and application to desalination

Ahn, Chang Hoon; Baek, Youngbin; Lee, Changha; Kim, Sang Ouk; Kim, Suhan; Lee, Sangho; Kim, Seung-Hyun; et al, JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.18, no.5, pp.1551 - 1559, 2012-09

6
Characterization of LSCO/Ir and LSCO/Ru structure as diffusion barrier layers for highly integrated memory devices

Kim, Il-Doo; Han, KY; Kim, Ho Gi, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.2, pp.11 - 14, 2004-02

7
Characterizations of polybenzimidazole based electrochemical hydrogen pumps with various Pt loadings for H-2/CO2 gas separation

Kim, Soo Jin; Lee, Byung-Seok; Ahn, Sang Hyun; Han, Jun Young; Park, Hee Young; Kim, Sung Hyun; Yoo, Sung Jong; et al, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.38, no.34, pp.14816 - 14823, 2013-11

8
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

9
Complementary Logic Gates and Ring Oscillators on Plastic Substrates by Use of Printed Ribbons of Single-Crystalline Silicon

Kim, Dae-Hyeong; Ahn, Jong-Hyun; Kim, Hoon-Sik; Lee, Keonjae; Kim, Tae-Ho; Yu, Chang-Jae; Nuzzo, Ralph G.; et al, IEEE ELECTRON DEVICE LETTERS, v.29, no.1, pp.73 - 76, 2008-01

10
Conformal bi-layered perovskite/spinel coating on a metallic wire network for solid oxide fuel cells via an electrodeposition-based route

Park, Beom Kyeong; Song, Rak-Hyun; Lee, Seung-Bok; Lim, Tak-Hyoung; Park, Seok-Joo; Jung, WooChul; Lee, Jong-Won, JOURNAL OF POWER SOURCES, v.348, pp.40 - 47, 2017-04

11
Core-shell structured Li-Fe electrode for high energy and stable thermal battery

Shin, Jaewook; Kang, Hyeonmuk; Lee, Yongju; Ha, Sang Hyeon; Cho, EunAe, RSC ADVANCES, v.12, no.8, pp.4795 - 4804, 2022-02

12
Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08

13
Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications

Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10

14
Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07

15
Effects of polyamidoamine dendrimers on the catalytic layers of a membrane electrode assembly in fuel cells

Lee, JH; Won, J; Oh, IH; Ha, HY; Cho, EunAe; Kang, YS, MACROMOLECULAR RESEARCH, v.14, no.1, pp.101 - 106, 2006-02

16
Exploring ultrafast flow chemistry by autonomous self-optimizing platform

Ahn, Gwang-Noh; Kang, Ji-Ho; Lee, Hyune-Jea; Park, Byung Eon; Kwon, Minjun; Na, Gi-Su; Kim, Heejin; et al, CHEMICAL ENGINEERING JOURNAL, v.453, 2023-02

17
Fabrication of a high thermal-stable methacrylate-silicate hybrid nanocomposite: hydrolytic versus non-hydrolytic sol-gel synthesis of methacryl-oligosiloxanes

Jin, Jung-Ho; Yang, Seung-Cheol; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.61, no.2, pp.321 - 327, 2012-02

18
Fabrication of microstructured silicon (mu s-Si) from a bulk Si wafer and its use in the printing of high-performance thin-film transistors on plastic substrates

Lee, Keonjae; Ahn, Heejoon; Motala, Michael J.; Nuzzo, Ralph G.; Menard, Etienne; Rogers, John A., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.7, pp.075018-1 - 075018-8, 2010-07

19
Fabrication of transparent methacrylate zirconium siloxane hybrid materials using sol-gel synthesized oligosiloxane resin

Bae, Jun-Young; Yang, Seung-Cheol; Jin, Jung-Ho; Jung, Kyung-Ho; Kim, Joon-Soo; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.58, no.1, pp.114 - 120, 2011-04

20
Heterogeneous three-dimensional electronics by use of printed semiconductor nanomaterials

Ahn, Jong-Hyun; Kim, Hoon-Sik; Lee, Keonjae; Jeon, Seokwoo; Kang, Seong Jun; Sun, Yugang; Nuzzo, Ralph G.; et al, SCIENCE, v.314, no.5806, pp.1754 - 1757, 2006-12

21
Improved stability of a phase change memory device using Ge-doped SbTe at varying ambient temperature

Wu, Zhe; Lee, Su-Youn; Park, Young-Wook; Ahn, Hyung-Woo; Jeong, Doo-Seok; Jeong, Jeung-hyun; No, Kwang-Soo; et al, APPLIED PHYSICS LETTERS, v.96, no.13, 2010-03

22
Ir and Ru bottom electrodes for (Ba, Sr) TiO3 thin films deposited by liquid delivery source chemical vapor deposition

Kim, Ho Gi, THIN SOLID FILMS, v.323, no.1-2, pp.285 - 290, 1998-06

23
Magnetophoretic position detection for multiplexed immunoassay using colored microspheres in a microchannel

Hahn, Young-Ki; Chang, Jae-Byum; Jin, Zong-Wen; Kim, Hak-Sung; Park, Je-Kyun, BIOSENSORS & BIOELECTRONICS, v.24, no.7, pp.1870 - 1876, 2009-03

24
Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05

25
Micro Light-Emitting Diodes for Display and Flexible Biomedical Applications

Lee, Haneol; Shin, Jung Ho; Park, Jung Hwan; Hong, Seong Kwang; Park, Sanghyun; Lee, Seung Hyung; Lee, Jae Hee; et al, ADVANCED FUNCTIONAL MATERIALS, v.29, no.24, 2019-06

26
Multiwavelength Raman characterization of silicon stress near through-silicon vias and its inline monitoring applications

Yoo, Woo Sik; Kim, Jae Hyun; Han, Seung Min J., JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, v.13, no.1, 2014-02

27
Nanoscale bit formation in highly (111)-oriented ferroelectric thin films deposited on glass substrates for high-density storage media

Kim, Dae Hong; Kim, Yong Kwan; Hong, Daniel Seungbum; Kim, Yunseok; Baik, Sunggi, NANOTECHNOLOGY, v.22, no.24, 2011-05

28
Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection

Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02

29
Parallel Fabrication of Electrode Arrays on Single-Walled Carbon Nanotubes using Dip-Pen-Nanolithography-Patterned Etch Masks

Park, Steve; Wang, Wechung Maria; Bao, Zhenan, LANGMUIR, v.26, no.9, pp.6853 - 6859, 2010-05

30
Protein micropatterning on bifunctional organic-inorganic sol-gel hybrid materials

Kim, Woo-Soo; Kim, Min-Gon; Ahn, Jun-Hyeong; Bae, Byeong-Soo; Park, Chan Beum, LANGMUIR, v.23, no.9, pp.4732 - 4736, 2007-04

31
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09

32
Self-Assembly of Metalloporphyrins into Light-Harvesting Peptide Nanofi ber Hydrogels for Solar Water Oxidation

Kim, Jae Hong; Nam, Dong Heon; Lee, Yang Woo; Nam, Yoon Sung; Park, Chan Beum, SMALL, v.10, no.7, pp.1272 - 1277, 2014-04

33
Silicon epitaxial growth on poly-Si film by HWCVD for low-temperature poly-Si TFTs

Lee, Seung Ryul; Ahn, Kyung Min; Ahn, Byung Tae, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.154, no.9, pp.778 - 781, 2007

34
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08

35
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P

Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01

36
Study on the Mechanism and Modeling for Super-filling of High-Aspect-Ratio Features with Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment

Kim, Chang-Gyu; Lee, Do-Seon; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.4, pp.334 - 341, 2011-04

37
Surface morphology improvement of metalorganic chemical vapor deposition Al films by layered deposition of Al and ultrathin TiN

Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, JAPANESE JOURNAL OF APPLIED PHYSICS, v.39, no.6A, pp.3349 - 3354, 2000-06

38
Synthesis of multi-walled carbon nanotube/silver nanocomposite powders by chemical reduction in aqueous solution

Daoush, Walid M.; Hong, Soon-Hyung, JOURNAL OF EXPERIMENTAL NANOSCIENCE, v.8, no.5, pp.578 - 587, 2013-07

39
THE EFFECT OF GLASS FRITS ON THE MICROSTRUCTURE AND ELECTRICAL-PROPERTIES OF BISMUTH RUTHENATE THICK-FILM RESISTORS

NAM, SH; Kim, Ho Gi, THIN SOLID FILMS, v.195, no.1-2, pp.43 - 51, 1991-01

40
The effect of plasma treatment on adsorbed iodine as a catalyst in chemical vapor deposition of copper and application to filling of deep trenches with high aspect ratios

Lee, Do-Seon; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.7, pp.076004-1 - 076004-6, 2009-07

41
Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp

Meitl, Mattew A; Zhu, Zheng-Tao; Kumar, Vipan; Lee, Keonjae; Feng, Xue; Huang, Yonggang Y; Adesida, Ilesanmi; et al, NATURE MATERIALS, v.5, no.1, pp.33 - 38, 2006-01

42
Transparent, thermally stable methyl siloxane hybrid materials using sol-gel synthesized vinyl-methyl oligosiloxane resin

Bae, Jun-Young; Jang, Junho; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.82, no.1, pp.253 - 260, 2017-04

43
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05

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