ANISOTROPICALLY CONDUCTIVE ADHESIVE; FLIP-CHIP; BONDED JOINTS; FAILURE MECHANISMS; THERMAL-STRESS; RELIABILITY; RESISTANCE; TECHNOLOGY; ASSEMBLIES; FATIGUE
ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4
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