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Paik, Kyung-Wook (백경욱)
교수, Department of Materials Science & Engineering(신소재공학과)
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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) Altmetrics
    1
    Article
    A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties

    Byeon, Jun-Ho; Yoon, Dal Jin; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.7, pp.1235 - 1243, 2019-07

    2
    Article
    The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection

    Lee, Seyong; Lee, Hanmin; Shin, SangMyung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06

    3
    Article
    A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

    Zhang, Shuye; Qi, Xiaoquan; Yang, Ming; et al, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183, 2019-05

    4
    Article
    Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly

    Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.5, pp.830 - 835, 2019-05

    5
    Article
    Effects of the Types of Anisotropic Conductive Films on the Bending Reliability of Chip-in-Plastic Packages

    Kim, Ji-Hyun; Kim, Ji-Hye; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.3, pp.405 - 411, 2019-03

    6
    Article
    A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-mu m Fine-Pitch Interconnection

    Lee, Sang-Hoon; Yoon, Dal-Jin; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.209 - 215, 2019-02

    7
    Article
    The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-mu m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly

    Lee, SeYong; Park, JongHo; Park, Jae-Hyeong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.10 - 17, 2019-01

    8
    Article
    Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

    Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.10, pp.1723 - 1728, 2018-10

    9
    Article
    Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly

    Lee, Ji-Soo; Kim, Ji-Hye; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.7, pp.1316 - 1322, 2018-07

    10
    Article
    Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

    Lee, Dongju; Lee, Seyong; Byun, Segi; et al, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.107, pp.217 - 223, 2018-04

    11
    Article
    A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature

    Zhang, Shuye; Yang, Ming; Wu, Yang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03

    12
    Article
    Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Zhang, Shuye; Yang, Ming; Jin, Ming Liang; et al, METALS, v.8, no.1, 2018-01

    13
    Article
    A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

    Zhang, Shuye; Lin, Tiesong; He, Peng; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12

    14
    Article
    Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly

    Zhang, Shuye; Lin, Tiesong; He, Peng; et al, MICROELECTRONICS RELIABILITY, v.78, pp.181 - 189, 2017-11

    15
    Article
    The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

    Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Sooresearcher; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10

    16
    Article
    A study on Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method

    Jung, Seung-Yoon; Hong, Hye-Eun; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1265 - 1271, 2017-08

    17
    Article
    Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

    Lee, Seyong; Lee, HanMin; Shin, Ji Won; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

    18
    Article
    Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake

    Kim, Jin; Kim, Jungmo; Song, Sungho; et al, CARBON, v.113, pp.379 - 386, 2017-03

    19
    Article
    Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

    Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03

    20
    Article
    Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump

    Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03

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