Researcher Page


Lee, Soon-Bok (이순복) C-1977-2011

Department of Mechanical Engineering(기계공학과)
Research Area
System Reliability and Design Research

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The Feasibility of Healable Electronics and Mechanical Behavior of Silver Nanowire (AgNW)/Healable Polymer Composite

Bae, Jong-Soo; Lee, Yong Seok; Li, Junpeng; et al, ADVANCED MATERIALS TECHNOLOGIES, v.3, no.6, 2018-06


Self-Heating-Induced Deterioration of Electromechanical Performance in Polymer-Supported Metal Films for Flexible Electronics

Jang, Dong-Won; Lee, Jeong-Hwan; Kim, Ansoon; et al, SCIENTIFIC REPORTS, v.7, 2017-10


Fatigue crack growth behavior of Mod.9Cr-1Mo steel at elevated temperatures: Effect of temperature, loading frequency and R ratio

Lee, Jeong Hwan; Lee, Hyeong-Yeon; Hong, Seong-Gu; et al, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.31, no.8, pp.3665 - 3669, 2017-08


Fracture mechanism and electromechanical behavior of chemical vapor deposited graphene on flexible substrate under tension

Lee, Jeong Hwan; Jang, Dong Won; Hong, Seong-Gu; et al, CARBON, v.118, pp.475 - 484, 2017-07


Structure-dependent mechanical behavior of copper thin films

Lee, Yong Seok; Ha, Sangyul; Park, Jin-Hyoung; et al, MATERIALS CHARACTERIZATION, v.128, pp.68 - 74, 2017-06


Evaluating the reliability of the cylinder liner of a low-speed marine engine subjected to high-cycle fatigue with high mean stress

Lee, Jeong Hwan; Jang, Dong Won; Hong,Seong Gu; et al, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.31, no.4, pp.1639 - 1644, 2017-04


Tensile and fatigue behavior of polymer supported silver thin films at elevated temperatures

Lee, Yong Seok; Sim, Gi-Dongresearcher; Bae, Jong -Soo; et al, MATERIALS LETTERS, v.193, pp.81 - 84, 2017-04


Fatigue life evaluation of pinion gears for the reliability of pitch systems in wind turbines

Kim, Si Won; Lee, Yong Seok; Jang, Dong Won; et al, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.31, no.2, pp.753 - 758, 2017-02


A comparison of methods for predicting the fatigue life of gray cast iron at elevated temperatures

Lee, Keum-Oh; Lee, Soon-Bokresearcher, FATIGUE FRACTURE OF ENGINEERING MATERIALS STRUCTURES, v.39, no.4, pp.439 - 452, 2016-04


Numerical and experimental investigation of a complete contact problem by comparing with an asymptotic analysis

Jang, Jae-Won; Kim, Hyung-Kyu; Lee, Soon-Bokresearcher, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.82, pp.39 - 46, 2016-03


A graphene meta-interface for enhancing the stretchability of brittle oxide layers

Won, Sejeong; Jang, Jae-Won; Choi, Hyung-Jin; et al, NANOSCALE, v.8, no.9, pp.4961 - 4968, 2016


Analysis of a complete contact problem in bonded condition: Comparison of experimental-numerical analyses and theoretical solutions

Kim, Hyung-Kyu; Jang, Jae-Won; Lee, Soon-Bokresearcher, TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, v.39, no.6, pp.583 - 588, 2015-06


Interlayer non-coupled optical properties for determining the number of layers in arbitrarily stacked multilayer graphenes

Hwangbo, Yun; Lee, Choong-Kwang; Mag-Isa, Alexander E.; et al, CARBON, v.77, pp.454 - 461, 2014-10


Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07


Double-layer CVD graphene as stretchable transparent electrodes

Won, Sejeong; Hwangbo, Yun; Lee, Seoung-Ki; et al, NANOSCALE, v.6, no.11, pp.6057 - 6064, 2014-06


An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope

Sim, Gidongresearcher; Park, Jun-Hyub; Uchic, Michael D.; et al, ACTA MATERIALIA, v.61, no.19, pp.7500 - 7510, 2013-11


Statistical Characteristics of Fatigue Failure of Copper Thin Films

Jang, Jae-Won; Hwangbo, Yun; Kim, Jae-Hyun; et al, JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.135, no.4, 2013-10


Effects of stretching and cycling on the fatigue behavior of polymer-supported Ag thin films

Sim, Gidongresearcher; Lee, Yong Seok; Lee, Soon-Bokresearcher; et al, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.575, pp.86 - 93, 2013-07


Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

Lee, Soon-Bokresearcher; JANG, Jae-Won, Journal of Computational Science and Technology, v.7, no.2, pp.265 - 277, 2013-06


Tensile characteristics of metal nanoparticle films on flexible polymer substrates for printed electronics applications

Kim, Sang Hyeok; Won, Sejeong; Sim, Gidongresearcher; et al, NANOTECHNOLOGY, v.24, no.8, 2013-03

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