Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P

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The reaction between electroless Ni-P and Sn and the crystallization behavior of Ni-P were investigated to better understand the effect of P content on the Ni-P layer. Electroless Ni-P specimens with three different P contents, 4.6 wt.%, 9 wt.%, and 13 wt.%, were used to study the effect of the P content and the microstructure of Ni-P on the subsequent crystallization and intermetallic compound (IMC) formation during the reaction between Ni-P and electroplated Sn. Ni3Sn4 was the major phase formed in all samples heated up to 300degreesC, which totally transformed into Ni3Sn2 when samples were heated up to 450degreesC and the Sn layer was 0.5-mum thick. The IMC formed on the nanocrystalline Ni-P showed stronger texture compared to that formed on the amorphous Ni-P Both the IMC thickness and density decreased with P content in the Ni-P layer, and Ni3Sn4 morphologies varied with P content. Dissolution of Ni into Sn increased with P content, which made IMC size in the bulk Sn increase with P content.
Publisher
SPRINGER
Issue Date
2004-07
Language
English
Article Type
Article
Keywords

REACTION-ASSISTED CRYSTALLIZATION; NICKEL; SOLDER; TRANSFORMATION; TECHNOLOGY; MICROSTRUCTURE; METALLIZATION; RELIABILITY; INTERFACE; PACKAGES

Citation

JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795

ISSN
0361-5235
DOI
10.1007/s11664-004-0243-2
URI
http://hdl.handle.net/10203/85495
Appears in Collection
MS-Journal Papers(저널논문)
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