Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 5621 to 5640 of 19301
| Electrodissolution Study of Al Thin Film with Microband Electrodes 변수일, Korean Corros. Sci. Soc., pp.10 - 10, 1992 |
| Electrogravimetric Study on the Lithium Transport through the Li1-dCoO2 Film Electrode Prepared by R.F. Magnetron Sputtering Pyun, Su Il, International Symposium on New Materials for Electrochemical Systems, 2001 |
| ELECTROHYDRAULIC FATIGUE APPARATUS FOR TESTING IN ULTRAHIGH-VACUUM AND CONTROLLED ENVIRONMENTS Lee, Won-Jong; CHUNG, YW; FINE, ME; BAKER, JP, REVIEW OF SCIENTIFIC INSTRUMENTS, v.57, no.11, pp.2854 - 2858, 1986-11 |
| Electroless Bimetal Decoration on N-Doped Carbon Nanotubes and Graphene for Oxygen Reduction Reaction Catalysts Lee, Won Jun; Choi, Dong Sung; Lee, Sun Hwa; Lim, Joonwon; Kim, Ji Eun; Li, Dongjun; Lee, Gil Yong; et al, PARTICLE & PARTICLE SYSTEMS CHARACTERIZATION, v.31, no.9, pp.965 - 970, 2014-09 |
| Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs) Paik, Kyung-Wook, Int. Advanced Tech. Workshop on Flip Chip Technology, pp.0 - 0, 1999-03-01 |
| Electroless Ni Plating Solutions for Reproducible Black Pad Analyses Yu, Jin, IMAPS 2013, IMAPS 2013, 2013-10-01 |
| Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 조문기; 전영두; 백경욱; 김중도; 김용남, 한국 마이크로 전자 및 패키징 학회 2003년도 추계 기술심포지움, 한국 마이크로 전자 및 패키징 학회, 2003-11-14 |
| Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 (Effects of Bi in Sn-based Pb Free solder interfacial reaction and Electroless Ni-PUBM) 조문기; 전영두; 백경욱; 김중도; 김용남, 한국 마이크로 전자 및 패키징 학회-(IMAPS-Korea) 2003년도 추계 기술심포지움, pp.128 - 132, 한국마이크로전자 및 패키징학회, 2003-11-14 |
| Electromagnetic metamaterials with bespoke impedance = 임피던스를 자유로이 제어할 수 있는 전자기파 메타물질link Heo, Minsung; Shin, Jong Hwa; et al, 한국과학기술원, 2019 |
| Electromagnetic Shielding of Monolayer MXene Assemblies Yun, Taeyeong; Kim, Hyerim; Iqbal, Aamir; Cho, Yong Soo; Lee, Gang San; Kim, Myung-Ki; Kim, Seon Joon; et al, ADVANCED MATERIALS, v.32, no.9, 2020-03 |
| Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, JW; Kim, JH; Paik, Kyung-Wook; Lee, HM, TMS 2004 133rd Annual Meeting & Exhibition, pp.294, 133rd TMS Annual Meeting, 2004-03 |
| Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
| Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, Jae-Woong; Kim, Jong Hoon; Lee, Hyuck-Mo; Paik, Kyung-Wook, 133rd TMS Annual Meeting, 133rd TMS Annual Meeting, 2004-03 |
| Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints Jung, Yong; Yu, Jin, JOURNAL OF APPLIED PHYSICS, v.115, no.8, 2014-02 |
| Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization Park, JH; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.93, no.2, pp.883 - 892, 2003-01 |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11 |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477, IEEE, 2007-05-29 |
| Electromigration Performance of Pb-free Solder Joints in Terms of Solder Composition and Joining Path Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Lee, HyuckMo, JOM, v.62, no.7, pp.22 - 29, 2010-07 |
| Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection Kim, Jungkyun; Rhee, Hakseung; Son, Myeong Won; Park, Juseong; Kim, Gwangmin; Song, Hanchan; Kim, Geunwoo; et al, ACS APPLIED ELECTRONIC MATERIALS, v.5, no.5, pp.2447 - 2453, 2023-04 |
| Electron beam induced degradation of CaS : Pb thin film phosphor grown by atomic layer deposition Yun, SJ; Park, SHK; Park, JB, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.6, no.2, pp.30 - 32, 2003-02 |
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