Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM
- Publisher
- 123
- Issue Date
- 2006-12-11
- Language
- English
- Citation
International Conference on Electronic Materials and Packaging, EMAP 2006
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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