DSpace at KOASAS: Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 (Effects of Bi in Sn-based Pb Free solder interfacial reaction and Electroless Ni-PUBM)

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College of Engineering(공과대학)Dept. of Nuclear and Quantum Engineering(원자력및양자공학과)NE-Conference Papers(학술회의논문)

Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 (Effects of Bi in Sn-based Pb Free solder interfacial reaction and Electroless Ni-PUBM)

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조문기 / 전영두 / 백경욱 researcher / 김중도 / 김용남

Publisher: 한국마이크로전자 및 패키징학회

Issue Date: 2003-11-14

Language: Korean

Citation: 한국 마이크로 전자 및 패키징 학회-(IMAPS-Korea) 2003년도 추계 기술심포지움, pp.128 - 132

URI: http://hdl.handle.net/10203/148932

Appears in Collection: NE-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)

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Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 (Effects of Bi in Sn-based Pb Free solder interfacial reaction and Electroless Ni-PUBM)

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