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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure

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Nah, JW / Kim, JH / Paik, Kyung-Wookresearcher / Lee, HM
Publisher
133rd TMS Annual Meeting
Issue Date
2004-03
Language
English
Citation

TMS 2004 133rd Annual Meeting & Exhibition, pp.294

URI
http://hdl.handle.net/10203/146492
Appears in Collection
MS-Conference Papers(학술회의논문)
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