Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM

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Publisher
IEEE
Issue Date
2007-05-29
Language
ENG
Citation

57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1410
Appears in Collection
MS-Conference Papers(학술회의논문)
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