Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints

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Effects of electric current flow on the Kirkendall void formation at solder joints were investigated using Sn-3.5Ag/Cu joints specially designed to have localized nucleation of Kirkendall voids at the Cu3Sn/Cu interface. Under the current density of 1 x 10(4) A/cm(2), kinetics of Kirkendall void growth and intermetallic compound thickening were affected by the electromigration (EM), and both showed the polarity effect. Cu6Sn5 showed a strong susceptibility to the polarity effect, while Cu3Sn did not. The electromigration force induced additional tensile (or compressive) stress at the cathode (or anode), which accelerated (or decelerated) the void growth. From the measurements of the fraction of void at the Cu3Sn/Cu interface on SEM micrographs and analysis of the kinetics of void growth, the magnitude of the local stress induced by EM was estimated to be 9 MPa at the anode and -7 MPa at the cathode.
Publisher
AMER INST PHYSICS
Issue Date
2014-02
Language
English
Article Type
Article
Keywords

INTERMETALLIC GROWTH; DIFFUSION; MANIFESTATIONS; KINETICS; COUPLES; STRESS

Citation

JOURNAL OF APPLIED PHYSICS, v.115, no.8

ISSN
0021-8979
DOI
10.1063/1.4867115
URI
http://hdl.handle.net/10203/186944
Appears in Collection
MS-Journal Papers(저널논문)
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