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Showing results 155761 to 155780 of 278036
| Plasma-Electron Coirradiation induced Fabrication of Hexagonal Non-Close-Packed Colloidal crystal monolayer 김재준; 조성오, 한국원자력학회 춘계학술대회, 한국원자력학회, 2011-05-25 |
| Plasma-enhanced ALD of titanium-silicon-nitride using TiCl4, SiH4, and N-2/H-2/Ar plasma Park, JS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.8, pp.C87 - C89, 2004 |
| Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4, SiH4, and N2/H2/Ar Plasma KANG SANG WON, Atomic Layer Deposition (ALD) 2002, 2002-01-01 |
| Plasma-Enhanced Atomic Layer Deposition of Aluminum Grown by a Sequential Supply of TMA and H2 Kang, Sang-Won, 3rd International AVS Conference on Microelectronics and Interfaces, ICMI, 2002-02 |
| Plasma-enhanced atomic layer deposition of HfO2 thin films using oxygen plasma Park, P.K.; Kang, Sungwon, 208th Meeting of The Electrochemical Society, pp.915 -, 2005-10-16 |
| Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer Jeong S.-J.; Shin Y.R.; Kwack W.S.; Lee H.W.; Jeong Y.K.; Kim D.I.; Kim H.C.; et al, SURFACE & COATINGS TECHNOLOGY, v.205, no.21-22, pp.5009 - 5013, 2011-08 |
| Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals Kwon, SH; Kwon, OK; Min, JS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.6, pp.G578 - G581, 2006 |
| Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for the Application of Cu Diffusion Barrier KANG SANG WON, AVS 6th International Conference on Atomic Layer Deposition, pp.0 - 0, 2004-08-01 |
| Plasma-enhanced atomic layer deposition of ruthenium thin films Kwon, OK; Kwon, SH; Park, HS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.4, pp.C46 - C48, 2004 |
| Plasma-enhanced atomic layer deposition of Ta(C)N thin films for copper diffusion barrier Kim K.H.; Seong-Jun Jeong; Yoon J.S.; Kim Y.M.; Kwon S.H., 5th Symposium on Atomic Layer Deposition - 216th Meeting of the Electrochemical Society, v.25, pp.301 - 308, 2009-10-05 |
| Plasma-enhanced atomic layer deposition of Ta-N thin films Park, JS; Park, HS; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.149, no.1, pp.28 - 32, 2002-01 |
| Plasma-enhanced atomic layer deposition of TaN thin films using tantalum-pentafluoride and N-2/H-2/Ar plasma Chung, Hoi-Sung; Kwon, Jung-Dae; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.11, pp.C751 - C754, 2006 |
| Plasma-enhanced atomic layer deposition of tantalum nitrides using hydrogen radicals as a reducing agent Park, JS; Lee, MJ; Lee, CS; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.4, no.4, pp.17 - 19, 2001-04 |
| Plasma-Enhanced Atomic Layer Deposition of TiAlN KANG SANG WON, 4th International AVS Conference on Microelectronics and Interfaces, pp.0 - 0, 2003-01-01 |
| Plasma-enhanced atomic layer deposition of TiN thin film using TiCl4 and N2/H2/Ar radicals KANG SANG WON, Atomic layer Deposition (ALD) 2002, 2002-01-01 |
| Plasma-Enhanced Atomic Layer Deposition of Uniform Hexagonal Boron Nitride Films Park, Hamin; Kim, Tae Keun; Cho, Sung Woo; Jang, Hong Seok; Lee, Sang Ick; Choi, Sung-Yool, MRS SPRING MEETING 2017, MRS SPRING MEETING 2017, 2017-04-20 |
| Plasma-Enhanced Atomic Layer Deposition Processed SiO2 Gate Insulating Layer for High Mobility Top-Gate Structured Oxide Thin-Film Transistors Ko, Jong Beom; Yeom, Hye In; Park, Sang-Hee Ko, IEEE ELECTRON DEVICE LETTERS, v.37, no.1, pp.39 - 42, 2016-01 |
| Plasma-Enhanced Atomic Layer Depposition of HfO2 Thin Films Using Oxygen Plasma Sang-Won Kang, 208th Meeting of The Electrochemical Society, 2005 |
| Plasma-Enhanced Chemical Vapor Deposition of Low-Resistive Tungsten Thin Films Y.T.Kim; S.K.Min; J.S.Hong; Kim, Choong Ki, APPLIED PHYSICS LETTERS, v.58, no.8, pp.837 - 839, 1991-02 |
| Plasma-etched Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Interconnection Lee, Sang Hoon; Kim, Tae Wan; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
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