Plasma-enhanced atomic layer deposition of Ta(C)N thin films for copper diffusion barrier

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Issue Date
2009-10-05
Language
ENG
Citation

5th Symposium on Atomic Layer Deposition - 216th Meeting of the Electrochemical Society, v.25, pp.301 - 308

URI
http://hdl.handle.net/10203/158870
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RIMS Conference Papers
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