Browse "College of Engineering(공과대학)" by Type Article
Showing results 53341 to 53400 of 62422
| Verification of SAMG entry condition for APR1400 Yun, Junghyun; Kim, Taewan; Kim, Jonghyun, ANNALS OF NUCLEAR ENERGY, v.75, pp.404 - 412, 2015-01 |
| Verification of the Peak Time Approach for Detection of Step Initiation using the UTRCEXO Cha, Dowan; Seo, Hyungtae; Oh, Sung Nam; Cho, Jungsan; Kim, Kab Il; Kim, Kyung-Soo; Kim, Soohyun, INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS, v.12, no.5, pp.1070 - 1076, 2014-10 |
| Verification of the prediction of deformation-induced anisotropy for simple deformation modes: uniaxial state and pure shear state of stress Lee, CH; Yang, Dong-Yol; Lee, YS, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.339, no.1-2, pp.302 - 311, 2003-01 |
| Verification study for a surface wave method based on harmonic wavelet analysis waves using a large-scale model testing site Kim, Dong-Soo; Kim, Jong-Tae; Park, HeonJoon; Bang, Eun Seok; Park, Hyung-Choon, JOURNAL OF APPLIED GEOPHYSICS, v.113, pp.74 - 85, 2015-02 |
| Verification, validation, and accreditation (VV&A) considering military and defense characteristics Kim, Junghoon; Jeong, Seung Min; Oh, Sunkyung; Jang, Young Jae, INDUSTRIAL ENGINEERING AND MANAGEMENT SYSTEMS, v.14, no.1, pp.88 - 93, 2015-03 |
| Verikube: Automatic and Efficient Verification for Container Network Policies Kang, Haney; Shin, Seungwon, IEICE TRANSACTIONS ON INFORMATION AND SYSTEMS, v.E105D, no.12, pp.2131 - 2134, 2022-12 |
| Verisim: Formal Analysis of Network Simulations Bhargavan, Karthikeyan; Gunter, Carl A.; Kim, Moonjoo; Lee, Insup; Obradovic, Davor; Sokolsky, Oleg; Viswanathan, Mahesh, 2011-01-18 |
| Verisim: Formal analysis of network simulations Bhargavan, K; Gunter, CA; Kim, Moonzoo; Lee, I; Obradovic, D; Sokolsky, O; Viswanathan, M, IEEE TRANSACTIONS ON SOFTWARE ENGINEERING, v.28, no.2, pp.129 - 145, 2002-02 |
| Versatile Carbon Hybrid Films Composed of Vertical Carbon Nanotubes Grown on Mechanically Compliant Graphene Films Lee, Duck Hyun; Kim, Ji Eun; Han, Tae Hee; Hwang, Jae Won; Jeon, Seokwoo; Choi, Sung-Yool; Hong, Soon Hyung; et al, ADVANCED MATERIALS, v.22, no.11, pp.1247 - 1252, 2010-03 |
| Versatile immunoassays based on isomagnetophoresis Hahn, Young-Ki; Park, Je-Kyun, LAB ON A CHIP, v.11, no.12, pp.2045 - 2048, 2011-06 |
| Versatile LED Drivers for Various Electronic Ballasts by Variable Switched Capacitor Lee, Eun S.; Choi, Bo H.; Duy Tan Nguyen; Jang, Gi C.; Rim, Chun Taek, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.31, no.2, pp.1489 - 1502, 2015-02 |
| Versatile Multilayer Transparent Electrodes for ITO-Free and Flexible Organic Solar Cells Han, Seungchan; Lim, Sooyeon; Kim, Hoyeon; Cho, Hyunsu; Yoo, Seunghyup, IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, v.16, no.6, pp.1656 - 1664, 2010 |
| Versatile post-synthetic Sn incorporation into hierarchically porous BEA zeolite for glucose isomerization in 1-butanol Eom, In Yong; Lee, Songhyun; Hwang, Sung Yeon; Choi, Minkee, MICROPOROUS AND MESOPOROUS MATERIALS, v.307, pp.110524, 2020-11 |
| Versatile Processing of Metal-Organic Framework-Fluoropolymer Composite Inks with Chemical Resistance and Sensor Applications Kim, Jin-Oh; Kim, Jin Yeong; Lee, Jeong-Chan; Park, Steve; Moon, Hoi Ri; Kim, Dong-Pyo, ACS APPLIED MATERIALS & INTERFACES, v.11, no.4, pp.4385 - 4392, 2019-01 |
| Versatile Size and Shape Microlens Arrays With High Numerical Apertures Lee, Hyunjoo J.; Kim, Yanghee; Yoon, Eui-Sung; Cho, Il-Joo, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.23, no.4, pp.771 - 773, 2014-08 |
| Versatile Strategy for Tuning ORR Activity of a Single Fe-N-4 Site by Controlling Electron-Withdrawing/Donating Properties of a Carbon Plane Mun, Yeongdong; Lee, Seonggyu; Kim, Kyeounghak; Kim, Seongbeen; Lee, Seunghyun; Han, Jeong Woo; Lee, Jinwoo, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.141, no.15, pp.6254 - 6262, 2019-04 |
| Versatile Transfer of an Ultralong and Seamless Nanowire Array Crystallized at High Temperature for Use in High-Performance Flexible Devices Seo, Min-Ho; Yoo, Jae-Young; Choi, So-Young; Lee, Jae Shin; Choi, Kwang-Wook; Jeong, Chang Kyu; Lee, Keon Jae; et al, ACS NANO, v.11, no.2, pp.1520 - 1529, 2017-02 |
| Versatile use of ZnO interlayer in hybrid solar cells for self-powered near infra-red photo-detecting application Kim, Jun Young; Vincent, Premkumar; Jang, Jaewon; Jang, Min Seok; Choi, Muhan; Bae, Jin-Hyuk; Lee, Changhee; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.813, 2020-01 |
| Versatile, transferrable 3-dimensionally nanofabricated Au catalysts with high-index crystal planes for highly efficient and robust electrochemical CO2 reduction Cho, Minhyung; Kim, Jong Min; Kim, Beomil; Yim, Soonmin; Kim, Ye Ji; Jung, Yeon Sik; Oh, Jihun, JOURNAL OF MATERIALS CHEMISTRY A, v.7, no.11, pp.6045 - 6052, 2019-03 |
| Versys Fibermetal Tapered Stem용 브로우치의 대퇴 골수강 내 삽입시 회전량 및 그 개선 박영배; 황득수; 임경빈; 윤용산, 대한정형외과연구학회지, v.10, no.2, pp.83 - 89, 2007-10 |
| Vertex adjustment method using geometric constraint for polygon-based shape coding Yun, BJ; Lee, SW; Kim, Seong-Dae, ELECTRONICS LETTERS, v.37, no.12, pp.754 - 755, 2001-06 |
| Vertical Alignment of Carbon Nanotubes Using the Magneto-Evaporation Method Youn, Sang-Cheon; Jung, Dae-Hwan; Ko, Young-Koan; Jin, Yong-Wan; Kim, Jong-Min; Jung, Hee-Tae, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.131, no.2, pp.742 - 748, 2009-01 |
| Vertical alignment of reduced graphene oxide/Fe-oxide hybrids using the magneto-evaporation method Youn, Sang-Cheon; Kim, Dae-Woo; Yang, Seung-Bo; Cho, Hye-Mi; Lee, Jae-Hyun; Jung, Hee-Tae, CHEMICAL COMMUNICATIONS, v.47, no.18, pp.5211 - 5213, 2011-03 |
| Vertical Channel ZnO Thin-Film Transistors Using an Atomic Layer Deposition Method Hwang, Chi-Sun; Park, Sang-Hee Ko; Oh, Himchan; Ryu, Min-Ki; Cho, Kyoung-Ik; Yoon, Sung-Min, IEEE ELECTRON DEVICE LETTERS, v.35, no.3, pp.360 - 362, 2014-03 |
| Vertical decomposition of a single cell in a three-dimensional arrangement of surfaces Cheong, Otfried; Sharir, M, DISCRETE & COMPUTATIONAL GEOMETRY, v.18, no.3, pp.269 - 288, 1997 |
| Vertical digital thermooptic switch in polymer Kwon, MS; Shin, Sang Yung; Choi, DS; Kim, KH, IEEE PHOTONICS TECHNOLOGY LETTERS, v.16, no.3, pp.783 - 785, 2004-03 |
Vertical Hydrodynamic Focusing and Continuous Acoustofluidic Separation of Particles via Upward Migration Ahmed, Husnain; Destgeer, Ghulam; Park, Jinsoo; Jung, Jin Ho; Sung, Hyung Jin, ADVANCED SCIENCE, v.5, no.2, 2018-02 |
| Vertical Inductive Bridge EBG (VIB-EBG) Structure With Size Reduction and Stopband Enhancement for Wideband SSN Suppression Kim, Myung-Hoi; Koo, Kyoung-Choul; Kim, Joung-Ho; Kim, Ji-Seong, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.22, no.8, pp.403 - 405, 2012-08 |
| Vertical InGaAs Biristor for Sub-1 V Operation Kim, Wu-Kang; Bidenko, Pavlo; Kim, Jongmin; Sim, Jaeho; Han, Joon-Kyu; Kim, Seongkwang; Geum, Dae-Myeong; et al, IEEE ELECTRON DEVICE LETTERS, v.42, no.5, pp.681 - 683, 2021-05 |
| VERTICAL INTEGRATION OF GAAS/ALGAAS LASER DIODE AND VERTICAL JFET Yoo, Hoi-Jun; Kwon, Young Se, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.27, no.3, pp.431 - 433, 1988-03 |
| Vertical Mirror Fabrication Combining KOH Etch and DRIE of (110) Silicon Lee, D; Yu, Kyoungsik; Krishnamoorthy, U; Solgaard, O, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.18, no.1, pp.217 - 227, 2009-02 |
| Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC Koo, Kyoung-Choul; Kim, Myung-Hoi; Kim, Jonghoon J.; Kim, Joung-Ho; Kim, Ji-Seong, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.3, pp.476 - 488, 2013-03 |
| Vertical order of DPPC multilayer enhanced by cholesterol-induced ripple-to-liquid ordered (LO) phase transition: Synchrotron X-ray reflectivity study Lee, Suho; Jeong, Dae-Woong; Choi, Myung-Chul, CURRENT APPLIED PHYSICS, v.17, no.3, pp.392 - 397, 2017-03 |
| Vertical Single-Walled Carbon Nanotube Arrays via Block Copolymer Lithography Lee, Duck Hyun; Lee, Won-Jong; Kim, Sang Ouk, CHEMISTRY OF MATERIALS, v.21, no.7, pp.1368 - 1374, 2009-04 |
| Vertical Single-Walled Carbon Nanotube Arrays via Block Copolymer Lithography Lee, Duck Hyun; Lee, Won Jong; Kim, Sang Ouk, Chemistry of Materials, Vol.21, pp.1368-1374, 2009 |
| Vertical stacking of three-dimensional nanostructures via an aerosol lithography for advanced optical applications Lee, Kiwoong; Choi, Hoseop; Kim, Dae Seong; Jang, Min Seok; Choi, Mansoo, NANOTECHNOLOGY, v.28, no.47, 2017-10 |
| Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04 |
| Vertical ZnO nanowires/graphene hybrids for transparent and flexible field emission Hwang, Jin-Ok; Lee, Duck-Hyun; Kim, Ju-Young; Han, Tae-Hee; Kim, Bong-Hoon; Park, Moon-Kyu; No, Kwang-Soo; et al, JOURNAL OF MATERIALS CHEMISTRY, v.21, no.10, pp.3432 - 3437, 2011-03 |
| Vertical-crystalline Fe-doped beta-Ni oxyhydroxides for highly active and stable evolution reaction Kim, Byeongyoon; Kabiraz, Mrinal Kanti; Lee, Jaewan; Choi, Changhyeok; Baik, Hionsuck; Jung, Yousung; Oh, Hyung-Suk; et al, MATTER, v.4, no.11, pp.3585 - 3604, 2021-11 |
| Vertical-Pillar Ferroelectric Field-Effect-Transistor Memory Lee, Sangho; Kim, Giuk; Kim, Taeho; Eom, Taehyong; Jeon, Sanghun, PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS, v.16, no.10, 2022-10 |
| Vertical-Tunnel Field-Effect Transistor Based on a Silicon–MoS2 Three-Dimensional–Two-Dimensional Heterostructure Shin, Gwang Hyuk; Koo, Bondae; Park, Hamin; Woo, Youngjun; Lee, Jae Eun; Choi, Sung-Yool, ACS APPLIED MATERIALS & INTERFACES, v.10, no.46, pp.40212 - 40218, 2018-11 |
| Vertical-tunneling field-effect transistor based on MoTe2/MoS2 2D-2D heterojunction Koo, Bondae; Shin, Gwang Hyuk; Park, Hamin; Kim, Hojin; Choi, Sung-Yool, JOURNAL OF PHYSICS D-APPLIED PHYSICS, v.51, no.47, pp.475101, 2018-10 |
| Vertical-Tunneling Field-Effect Transistor Based on WSe2-MoS2 Heterostructure with Ion Gel Dielectric Jeon, Hyun Bae; Shin, Gwang Hyuk; Lee, Khang June; Choi, Sung-Yool, ADVANCED ELECTRONIC MATERIALS, v.6, no.7, pp.2000091, 2020-07 |
| Vertically aligned carbon nanopillars with size and spacing control for a transparent field emission display Lee, Seok Woo; Lee, Chang Hwa; Lee, Jung A.; Lee, Seung Seob, NANOTECHNOLOGY, v.24, no.2, 2013-01 |
| Vertically aligned carbon nanotubular structure for guiding uniform lithium deposition via capillary pressure as stable metallic lithium anodes Moorthy, Brindha; Kim, Joo-Hyung; Lee, Hyun-Wook; Kim, Do Kyung, ENERGY STORAGE MATERIALS, v.24, pp.602 - 609, 2020-01 |
| Vertically aligned graphene prepared by the electrochemical anodization of graphite foil for supercapacitor electrodes Lee, Na Eun; Lee, Jaewoo; Jeong, Heon Yong; Lee, Sang Yoon; Cho, Sung Oh, JOURNAL OF POWER SOURCES, v.526, 2022-04 |
| Vertically Aligned Nanopatterns of Amine-Functionalized Ti(3)C(2)MXene via Soft Lithography Song, Tae-Eun; Yun, Hwajin; Kim, Yong-Jae; Jeon, Ho Seung; Ha, Kyungryul; Jung, Hee-Tae; Han, Hee; et al, ADVANCED MATERIALS INTERFACES, v.7, no.18, pp.2000424, 2020-09 |
| Vertically aligned nanostructures for a reliable and ultrasensitive SERS-active platform: Fabrication and engineering strategies Liu, Yang; Kim, Minjoon; Cho, Seunghee H.; Jung, Yeon Sik, NANO TODAY, v.37, 2021-04 |
| Vertically aligned P(VDF-TrFE) core-shell structures on flexible pillar arrays Choi, Yoon-Young; Yun, Tae Gwang; Qaiser, Nadeem; Paik, Haemin; Roh, Hee Seok; Hong, Jongin; Hong, Daniel Seungbum; et al, SCIENTIFIC REPORTS, v.5, 2015-06 |
| Vertically Formed Graphene Stripe for 3D Field-Effect Transistor Applications Hong, Seul Ki; Bong, Jae Hoon; Cho, Byung-Jin; Hwang, Wan Sik, SMALL, v.13, no.3, 2017-01 |
| Vertically Integrated CMOS Ternary Logic Device with Low Static Power Consumption and High Packing Density Han, Joon-Kyu; Lee, Jung Woo; Kim, Young Bin; Yun, Seong-Yun; Yu, Jiman; Lee, Keon Jae; Choi, Yang-Kyu, ACS APPLIED MATERIALS & INTERFACES, v.15, no.44, pp.51429 - 51434, 2023-10 |
| Vertically Integrated Multiple Nanowire Field Effect Transistor Lee, Byung Hyun; Kang, Min Ho; Ahn, Dae Chul; Park, Jun Young; Bang, Tewook; Jeon, Seung Bae; Hur, Jae; et al, NANO LETTERS, v.15, no.12, pp.8056 - 8061, 2015-12 |
| Vertically Integrated Nanowire-Based Unified Memory Lee, Byung-Hyun; Ahn, Dae-Chul; Kang, Min-Ho; Jeon, Seung-Bae; Choi, Yang-Kyu, NANO LETTERS, v.16, no.9, pp.5909 - 5916, 2016-09 |
| Vertically Integrated Nanowire-Based Zero-Capacitor Dynamic Random Access Memory Lee, Byung-Hyun; Kang, Min-Ho; Ahn, Dae-Chul; Choi, Yang-Kyu, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.6, no.1, pp.Q1 - Q5, 2017 |
| Vertically Integrated Unidirectional Biristor Moon, Dong-Il; Choi, Sung-Jin; Kim, Sung-Ho; Oh, Jae-Sub; Kim, Young-Su; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.32, no.11, pp.1483 - 1485, 2011-11 |
| Vertically oriented titania nanotubes prepared by anodic oxidation on Si substrates Yang, Dae-Jin; Kim, Ho-Gi; Cho, Seong-Je; Choi, Won-Youl, IEEE TRANSACTIONS ON NANOTECHNOLOGY, v.7, no.2, pp.131 - 134, 2008-03 |
| Vertically Oriented, Three-Dimensionally Tapered Deep-Subwavelength Metallic Nanohole Arrays Developed by Photofluidization Lithography Lee, Sol-Ah; Kang, Hong-Suk; Park, Jung-Ki; Lee, Seungwoo, ADVANCED MATERIALS, v.26, no.44, pp.7521 - 7528, 2014-11 |
| Vertically sheathing laminar flow-based immunoassay using simultaneous diffusion-driven immune reactions Kurmashev, Amanzhol; Kwon, Seyong; Park, Je-Kyun; Kang, Joo H., RSC ADVANCES, v.9, no.41, pp.23791 - 23796, 2019-08 |
| Vertically stacked thin triboelectric nanogenerator for wind energy harvesting Seol, Myeong-Lok; Woo, Jong-Ho; Jeon, Seung-Bae; Kim, Daewon; Park, Sang-Jae; Hur, Jae; Choi, Yang-Kyu, NANO ENERGY, v.14, pp.201 - 208, 2015-05 |
| Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors Choi, Junhwan; Lee, Changhyeon; Lee, Chungryeol; Park, Hongkeun; Lee, Seung Min; Kim, Chang-Hyun; Yoo, Hocheon; et al, NATURE COMMUNICATIONS, v.13, no.1, pp.2305, 2022-04 |
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