Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject CU
Showing results 1 to 60 of 74
| A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
| Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| Atom probe tomography study of ultrahigh nanocrystallization rates in FeSiNbBCu soft magnetic amorphous alloys on rapid annealing Pradeep, KG; Herzer, G; Choi, Pyuck Pa; Raabe, D, ACTA MATERIALIA, v.68, pp.295 - 309, 2014-04 |
| Atomic layer deposition of nickel by the reduction of preformed nickel oxide Chae, Junghun; Park, Hyuong-Sang; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.5, no.6, pp.C64 - C66, 2002-06 |
| Atomic layer deposition of ruthenium thin films for copper glue layer Kwon, OK; Kim, JH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.2, pp.G109 - G112, 2004-01 |
| Boosting Electrochemical CO2 Reduction to Methane via Tuning Oxygen Vacancy Concentration and Surface Termination on a Copper/Ceria Catalyst Patra, Kshirodra Kumar; Liu, Zhu; Lee, Hojeong; Hong, Seungwon; Song, Hakhyeon; Abbas, Hafiz Ghulam; Kwon, Youngkook; et al, ACS CATALYSIS, v.12, no.17, pp.10973 - 10983, 2022-09 |
| Calculation of surface tension and wetting properties of Sn-based solder alloys Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.297 - 302, 1999-01 |
| Chemical Control Of The Grain-Boundary Migration Of SrTiO3 in The SrTiO3-BaTiO3-CaTiO3 System Yoon, KJ; Kang, Suk-Joong L, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.76, no.6, pp.1641 - 1644, 1993-06 |
| Cohesive failure of the Cu/polyimide system Park, IS; Ahn, EC; Yu, Jin; Lee, HY, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.282, no.1-2, pp.137 - 144, 2000-04 |
| Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 |
| Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10 |
| Crystallization of amorphous WNx films Suh, BS; Cho, HK; Lee, YJ; Lee, WJ; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.89, no.7, pp.4128 - 4133, 2001-04 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging Jeong, SW; Kim, JH; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1530 - 1544, 2004-12 |
| Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate Choi, WK; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.11, pp.1251 - 1255, 1999 |
| Effects of (NH4)(2)SO4 and BTA on the nanostructure of copper foam prepared by electrodeposition Nam, Do-Hwan; Kim, Ryoung-Hee; Han, Dong-Wook; Kim, Jeong-Han; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.56, no.25, pp.9397 - 9405, 2011-10 |
| Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders Chang, Jaewon; Seo, Sun-Kyoung; Cho, Moon Gi; Lee, Dong Nyung; Kang, Kyoo-Sik; Lee, Hyuck Mo, JOURNAL OF MATERIALS RESEARCH, v.27, no.14, pp.1877 - 1886, 2012-07 |
| Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development Lee, Jung-Sub; Chu, Kun-Mo; Patzelt, Rainer; Manessis, Dionysios; Ostmann, Andreas; Jeon, DukYoung, MICROELECTRONIC ENGINEERING, v.85, no.7, pp.1577 - 1583, 2008-07 |
| Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 |
| Effects of platinum loading on the performance of proton exchange membrane fuel cells with high ionomer content in catalyst layers Ahn, Sang Hyun; Jeon, Sunyeol; Park, Hee-Young; Kim, Soo-Kil; Kim, Hyoung-Juhn; Cho, EunAe; Henkensmeier, Dirk; et al, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.38, no.23, pp.9826 - 9834, 2013-08 |
| Effects of SiO2 Addition in FePt on Microstructures and Magnetic Properties on Two Different MgO Substrates Byun, W. B.; Lee, Kyung-Jin; Lee, Taek Dong, IEEE TRANSACTIONS ON MAGNETICS, v.45, no.6, pp.2705 - 2708, 2009-06 |
| Effects of Solder Ball Geometry on Lap Shear Creep Rate Kim, Sung-Bum; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.3, pp.326 - 332, 2010-03 |
| Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10 |
| Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11 |
| Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints Jee, YK; Yu, Jin; Ko, YH, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2776 - 2784, 2007-10 |
| Effects of Zr addition on the phase stability of L1(2)-based Al-Ti-Cr alloys Chun, DH; Lee, JK; Oh, MH; Wee, Dang-Moon, MATERIALS LETTERS, v.59, no.23, pp.2923 - 2927, 2005-10 |
| Electrochemical analysis on the potential decay behavior of Fe-20Cr stainless steels in sulfuric acid solution Kim, YoungJun; Oh, Se-Kwon; Ahn, Soohoon; Oh, KkochNim; Jung, Ki Min; Kwon, HyukSang, ELECTROCHIMICA ACTA, v.266, pp.1 - 6, 2018-03 |
| Electrochemical carbon dioxide reduction on copper-zinc alloys: ethanol and ethylene selectivity analysis Baek, Yeji; Song, Hakhyeon; Hong, Deokgi; Wang, Suneon; Lee, Sungwoo; Joo, Young-Chang; Lee, Gun-Do; et al, JOURNAL OF MATERIALS CHEMISTRY A, v.10, no.17, pp.9393 - 9401, 2022-05 |
| Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
| Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization Park, JH; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.93, no.2, pp.883 - 892, 2003-01 |
| Fabrication of sintering-free flexible copper nanowire/polymer composite transparent electrodes with enhanced chemical and mechanical stability Chu, Cho Rong; Lee, Changsoo; Koo, Jahyun; Lee, Hyuck-Mo, NANO RESEARCH, v.9, no.7, pp.2162 - 2173, 2016-07 |
| Facile electrochemical synthesis of dilute AuCu alloy nanostructures for selective and long-term stable CO2 electrolysis Kim, Jaehoon; Song, Jun Tae; Oh, Jihun, JOURNAL OF CHEMICAL PHYSICS, v.153, no.5, 2020-08 |
| Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257, 2013-08 |
| Formation of intermetallic compounds in the Ni bearing lead free composite solders Lee, JW; Lee, ZH; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2344 - 2350, 2005-11 |
| Glass formation in metallic Al-Ni-Y Kim, Young Kwan; Soh, Jeong Ryong; Kim, Do Kyung; Lee, HyuckMo, JOURNAL OF NON-CRYSTALLINE SOLIDS, v.242, no.2-3, pp.122 - 130, 1998-12 |
| Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints Kim, Sung-Hwan; Yu, Jin, MATERIALS LETTERS, v.106, pp.75 - 78, 2013-09 |
| Improved TiN film as a diffusion barrier between copper and silicon Rha, SK; Lee, WJ; Lee, SY; Hwang, YS; Lee, YJ; Kim, DI; Kim, DW; et al, THIN SOLID FILMS, v.320, no.1, pp.134 - 140, 1998-05 |
| Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun, SS, JOURNAL OF MATERIALS RESEARCH, v.12, no.12, pp.3367 - 3372, 1997-12 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
| Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.1, pp.259 - 269, 2014-01 |
| Investigation of the diffusion behavior of sodium in Cu(In,Ga)Se-2 layers Laemmle, Anke; Wuerz, Roland; Schwarz, Torsten; Cojocaru-Miredin, Oana; Choi, Pyuck-Pa; Powalla, Michael, JOURNAL OF APPLIED PHYSICS, v.115, no.15, 2014-04 |
| Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
| Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12 |
| Metalorganic chemical vapor deposition of copper on ruthenium thin film Kwak, Dong-Kee; Lee, Hyun-Bae; Han, Jae-Won; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.9, no.10, pp.C171 - C173, 2006 |
| Microstructural evolution of joint interface between eutectic 80Au-20Sn solder and UBM Kim, SS; Kim, JH; Booh, SW; Kim, TG; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2400 - 2405, 2005-11 |
| Microstructure evolution of novel Sn islands prepared by electrodeposition as anode materials for lithium rechargeable batteries Kim, Ryoung-Hee; Kim, KiTae; Lim, Sung-Jin; Nam, Do-Hwan; Han, Dongwook; Kwon, HyukSang, RSC ADVANCES, v.7, no.48, pp.30428 - 30432, 2017 |
| Modulation of plastic flow in metallic glasses via nanoscale networks of chemical heterogeneities Kim, Jinwoo; Oh, Hyun Seok; Kim, Wan; Choi, Pyuck-Pa; Raabe, Dierk; Park, Eun Soo, ACTA MATERIALIA, v.140, pp.116 - 129, 2017-11 |
| New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca Koo, Jahyun; Chang, Jaewon; Lee, Young Woo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.608, pp.126 - 132, 2014-09 |
| Non-oxidized bare copper nanoparticles with surface excess electrons in air Chung, Kyungwha; Bang, Joonho; Thacharon, Athira; Song, Hyun Yong; Kang, Se Hwang; Jang, Woo-Sung; Dhull, Neha; et al, NATURE NANOTECHNOLOGY, v.17, no.3, pp.285 - 291, 2022-03 |
| PEALD of a ruthenium adhesion layer for copper interconnects Kwon, OK; Kwon, SH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.12, pp.C753 - C756, 2004 |
| Performance improvement in CdTe solar cells by modifying the CdS/CdTe interface with a Cd treatment Yun, Jae Ho; Cha, Eun Seok; Ahn, Byung Tae; Kwon, Hyuk-Sang; Al-Ammar, Essam A., CURRENT APPLIED PHYSICS, v.14, no.4, pp.630 - 635, 2014-04 |
| Photoluminescence Enhancement of Synthesized ZnS-Based-Nanocrystals and Aging Effect on Its Emitting Color Han, Ji-Yeon; Kim, Dong-Hyuk; Kim, Hyun-Ki; Jeon, Duk-Young, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.12, no.2, pp.1323 - 1327, 2012-02 |
| Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals Kwon, SH; Kwon, OK; Min, JS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.6, pp.G578 - G581, 2006 |
| Plasma-enhanced atomic layer deposition of ruthenium thin films Kwon, OK; Kwon, SH; Park, HS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.4, pp.C46 - C48, 2004 |
| Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06 |
| Reactive ion etching mechanism of copper film in chlorine-based electron cyclotron resonance plasma Lee, SK; Chun , Soung Soon; Hwang, CY; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.1A, pp.50 - 55, 1997-01 |
| Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.10, pp.3486 - 3499, 2015-10 |
| Residual stress effect on self-annealing of electroplated copper Lee, CH; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.7, pp.4484 - 4488, 2003-07 |
| Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
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