Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate
By comparing the activation energy for nucleation of individual intermetallic compound (IMC), the IMC phase that forms first is predicted as the one with the smallest activation energy. This methodology has been successfully applied to observations of IMC phases that form during liquid soldering on Cu and Ni plates. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Issue Date
- 2002-06
- Language
- English
- Article Type
- Article
- Keywords
SOLID-LIQUID INTERFACE; STRUCTURAL MODEL; SYSTEMS; CU; SN-3.5AG; PHASES; JOINTS; GROWTH; ALLOY; TIN
- Citation
SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781
- ISSN
- 1359-6462
- Appears in Collection
- MS-Journal Papers(저널논문)
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