Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation

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Sn-3.5Ag-xFe (x = 0.1, 0.5, 1.0 and 2.0 wt.%) solders were reacted with electroplated Cu under bump metallization and the characteristics of Kirkendall void formation at the solder joints were investigated. An electroplating process was carried out in a Cu sulfate bath with an additive. The results show that the formation of Kirkendall voids at the solder joint decreased with the Fe content due to the scavenging of S originating from the additive. (c) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Issue Date
2013-08
Language
English
Article Type
Article
Keywords

JOINTS; CU; SEGREGATION; RELIABILITY; ZN; SURFACE

Citation

SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257

ISSN
1359-6462
DOI
10.1016/j.scriptamat.2013.04.010
URI
http://hdl.handle.net/10203/175010
Appears in Collection
MS-Journal Papers(저널논문)
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