Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation

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dc.contributor.authorKim, Sung-Hwanko
dc.contributor.authorYu, Jinko
dc.date.accessioned2013-08-14T01:08:31Z-
dc.date.available2013-08-14T01:08:31Z-
dc.date.created2013-08-09-
dc.date.created2013-08-09-
dc.date.issued2013-08-
dc.identifier.citationSCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257-
dc.identifier.issn1359-6462-
dc.identifier.urihttp://hdl.handle.net/10203/175010-
dc.description.abstractSn-3.5Ag-xFe (x = 0.1, 0.5, 1.0 and 2.0 wt.%) solders were reacted with electroplated Cu under bump metallization and the characteristics of Kirkendall void formation at the solder joints were investigated. An electroplating process was carried out in a Cu sulfate bath with an additive. The results show that the formation of Kirkendall voids at the solder joint decreased with the Fe content due to the scavenging of S originating from the additive. (c) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectJOINTS-
dc.subjectCU-
dc.subjectSEGREGATION-
dc.subjectRELIABILITY-
dc.subjectZN-
dc.subjectSURFACE-
dc.titleFe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation-
dc.typeArticle-
dc.identifier.wosid000320841900013-
dc.identifier.scopusid2-s2.0-84878576279-
dc.type.rimsART-
dc.citation.volume69-
dc.citation.issue3-
dc.citation.beginningpage254-
dc.citation.endingpage257-
dc.citation.publicationnameSCRIPTA MATERIALIA-
dc.identifier.doi10.1016/j.scriptamat.2013.04.010-
dc.contributor.localauthorYu, Jin-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorAging-
dc.subject.keywordAuthorAnnealing-
dc.subject.keywordAuthorAuger electron spectroscopy (AES)-
dc.subject.keywordAuthorMetallizations-
dc.subject.keywordAuthorSegregation-
dc.subject.keywordPlusJOINTS-
dc.subject.keywordPlusCU-
dc.subject.keywordPlusSEGREGATION-
dc.subject.keywordPlusRELIABILITY-
dc.subject.keywordPlusZN-
dc.subject.keywordPlusSURFACE-
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